Non-Isothermal Temperature Cycling for Semiconductor Testing
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Solution Overview
Problem
Current temperature cycling methods for semiconductor testing are isothermal and fail to accurately simulate real-world conditions, leading to inadequate reflection of thermo-mechanical stresses experienced by chips during power on/off cycling, resulting in inconsistent and limited testing outcomes.
Innovation Solution
A non-isothermal temperature cycling system that thermally couples semiconductor devices to heating and cooling elements via a vacuum holding component, allowing for individually controlled heating and cooling of semiconductor devices to mimic real-world usage conditions, enabling universal testing of various semiconductor designs without specialized hardware.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If ambient temperature controlled isothermal testing is used, then testing simplicity is maintained, but testing accuracy in reflecting real-world conditions deteriorates
Solution Approach 1:
The patent segments the temperature control function by introducing independent heating and cooling elements that can be controlled separately from the ambient chamber. This allows the die to experience non-uniform temperature distribution where the die portion can be heated independently while other components are cooled by ambient air, mimicking real operating conditions where the powered die acts as a heat source and other components act as heat dissipaters.
Solution Approach 2:
The patent applies local quality by creating different thermal conditions in different regions of the package. The die portion receives focused heating from the heating element while other components are cooled by ambient air flow. This local differentiation in thermal treatment creates the non-uniform temperature distribution that accurately reflects real-world operating conditions.
2Temperature
If self-heating method is used, then non-uniform temperature distribution is achieved, but thermal consistency across devices deteriorates
Solution Approach 1:
The patent introduces an intermediary heating element that is thermally coupled to the die through a vacuum holding component. This intermediary element acts as a controlled heat source that can be precisely regulated, replacing the uncontrolled self-heating mechanism. The heating element provides consistent, repeatable heating across different devices while maintaining the non-uniform temperature distribution characteristic of real operating conditions.
3Measurement precision
If real application system testing is used, then real-world conditions are simulated, but testing cost and complexity increase
Solution Approach 1:
The patent extracts the essential thermal characteristics of real-world operating conditions from the complex real application system. Instead of requiring a complete computer system with power management software and multiple components, the invention isolates the critical thermal behavior by using a simplified setup with a heating element, vacuum holding component, and ambient air cooling. This extraction maintains testing accuracy while dramatically reducing system complexity and cost.
Solution Approach 2:
The patent creates a simplified copy of the real operating thermal environment. Rather than using the actual application system, the invention replicates the essential thermal dynamics through a model system with controlled heating and ambient cooling. This copy captures the non-uniform temperature distribution and thermal stress mechanisms without requiring the full complexity of the original system.
4Ease of operation
If ambient temperature cooling is used, then cooling simplicity is maintained, but cooling speed and cycle rate deteriorate
Solution Approach 1:
The patent implements periodic action by alternating between controlled heating phases and ambient cooling phases. The heating element is activated during heating cycles to rapidly raise the die temperature, then turned off during cooling cycles where ambient air provides passive cooling. This periodic on/off cycling of the heating element, combined with the vacuum holding component's thermal properties, enables faster temperature transitions and higher cycle rates while maintaining operational simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides accelerated and economical testing of semiconductor devices under real-world-like conditions, effectively detecting thermo-mechanical failures and optimizing material compositions for longer product lifetime, while reducing testing time and costs.
Implementation Method 1
heating and cooling a die portion of the semiconductor device with the heating and cooling element
Implementation Method 2
thermally coupling the semiconductor device to a heating and cooling element via a vacuum holding component
Implementation Method 3
the thermal expansion coefficient of a silicon die and the thermal expansion coefficient of its substrate may be different. Thus, at higher temperatures the substrate may expand more than the die unfortunately causing stress at the interface between the die and the substrate
Data Source
AI summary
A system and method for non-isothermal temperature cycling (also called Conduction Temperature Cycling) of a semiconductor device. The method includes inserting a semiconductor device into a testing chamber and thermally coupling the semiconductor device to a heating and cooling element via a vacuum holding component. The method further includes heating and cooling a die portion of the semiconductor device with the heating and cooling element and testing the semiconductor device for component failure caused by thermo-mechanical stress induced by the non-isothermal temperature cycling. In one embodiment, the heating and cooling comprises non-isothermal temperature cycling.