Non-orthogonal Ball Grid Array for High Signal Density
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Solution Overview
Problem
Conventional ball grid arrays face challenges in increasing signal density without increasing package size, as reducing the pitch between solder balls becomes impractical due to difficulties in routing traces and coupling with circuit boards, especially in asymmetrical devices like SRAMs and DRAMs, where optical shrinkage can render standard orthogonal grids unusable.
Innovation Solution
Implementing a non-orthogonal ball grid array with a triangular configuration, allowing for varying row and column spacings based on the available substrate area and number of connection balls, which can increase connection ball density and accommodate more signals within a smaller footprint by rotating and orienting the grid to optimize placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch between solder balls is reduced to increase signal density, then the number of connections increases, but routing traces and coupling with circuit boards becomes impractical
Solution Approach 1:
The patent applies asymmetry by transitioning from a conventional orthogonal grid to a non-orthogonal ball grid array configuration. This asymmetric arrangement allows for optimized spacing between balls in different directions, enabling higher connection density while maintaining practical trace routing paths and coupling feasibility. The non-orthogonal geometry provides flexibility in signal path design that symmetric orthogonal grids cannot achieve.
Solution Approach 2:
The patent changes the geometric parameters of the ball grid array by using non-orthogonal angles instead of 90-degree intersections. This parameter change allows for variable pitch distances between adjacent balls, enabling denser packing in certain directions while preserving sufficient spacing for manufacturing processes such as trace routing and board coupling in other directions.
2Quantity of substance
If the package size is increased to accommodate additional signals, then the signal count increases, but the mounted footprint increases
Solution Approach 1:
The non-orthogonal ball grid array uses asymmetric angular relationships between rows and columns, allowing for more efficient space utilization. This asymmetric configuration enables a higher number of connection balls to be packed into a smaller substrate area compared to traditional orthogonal grids, thereby increasing signal count without proportionally increasing the mounted footprint.
Solution Approach 2:
The patent introduces angular dimensionality by using non-orthogonal intersections at specific angles (e.g., 60 degrees). This dimensional change from purely orthogonal to angled geometry allows for more compact arrangement of connection balls, effectively increasing the information density per unit area and reducing the overall package footprint for a given signal count.
3Productivity
If optical shrink of masking process is used to improve manufacturing efficiency, then production efficiency increases, but standard orthogonal grids may no longer be usable
Solution Approach 1:
The patent changes the geometric parameters of the ball grid array to non-orthogonal configurations that are better suited for modern optical shrink masking processes. By designing with angled intersections rather than strict 90-degree angles, the grid becomes more compatible with high-efficiency manufacturing techniques while maintaining the necessary connection density and routing capabilities.
Data Source
AI summary
An apparatus includes a contact grid array disposed on a substrate in a non-orthogonal row-column format with connection elements arranged in a hexagonal configuration. The contact grid array has an orientation based, at least in part, on an area available for the contact grid array on the substrate. A method to determine the orientation of the contact grid array includes identifying the area available for a contact grid array on a substrate and determining the orientation for the contact grid array based, at least in part, on the area available for the contact grid array on the substrate.