Non-PFAS Refrigerant Composition for Electronics Immersion Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing refrigerants used for cooling and heating electronics often have high Global Warming Potential (GWP) and Ozone Depletion Potential (ODP), are classified as PFAS, and do not meet safety and environmental criteria, making them unsuitable for immersion cooling applications, especially in high-performance electronic devices.
Innovation Solution
Development of non-PFAS fluorine substituted olefins, specifically cis-1,1,2,3,4,4-hexafluorobut-2-ene, trans-1,1,2,3,4,4-hexafluorobut-2-ene, cis-1,2,3,3,4,4-hexafluorobut-1-ene, and trans-1,2,3,3,4,4-hexafluorobut-1-ene, with a 3:3:2:2 weight ratio, and a synthesis method involving the reaction of 1,1,2,3,3,4,4-heptafluorobut-1-ene with a hydride source to yield these compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional refrigerants are used for cooling electronics, then cooling performance is achieved, but Global Warming Potential and Ozone Depletion Potential are high
Solution Approach 1:
The patent changes the chemical composition parameters of refrigerants by developing fluorine-substituted olefins with specific molecular structures (Formula I) that have low GWP and ODP values while maintaining effective boiling points between -50°C and 50°C for electronic cooling applications
Solution Approach 2:
The patent creates composite refrigerant formulations by combining fluorine-substituted olefin compounds with specific physical and chemical properties to achieve both environmental compliance and effective thermal management performance
2Stability of the object's composition
If PFAS substances are used as refrigerants, then thermal stability is achieved, but environmental persistence and toxicity increase
Solution Approach 1:
The patent extracts the harmful perfluoroalkyl and polyfluoroalkyl substance structures from the refrigerant molecules while retaining the beneficial fluorine substitution patterns that provide thermal stability, thereby eliminating environmental persistence and toxicity
Solution Approach 2:
The patent modifies the molecular structure parameters by limiting fluorine substitution to specific positions (Formula I) and controlling the number of fluorine atoms, achieving thermal stability without creating persistent PFAS environmental contaminants
3Temperature
If refrigerants with low boiling points are used for immersion cooling, then cooling efficiency is improved, but dielectric constant increases
Solution Approach 1:
The patent optimizes multiple parameters simultaneously by designing fluorine-substituted olefins with specific molecular weights and structures that achieve low boiling points for efficient immersion cooling while maintaining low dielectric constants through controlled fluorine substitution patterns
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides refrigerants with low GWP, low ODP, non-flammability, and suitable boiling points for effective thermal management of electronic components, maintaining reliability and longevity while meeting environmental and safety standards.
Implementation Method 1
immersion cooling and/or heating of electronics during operation thereof
Implementation Method 2
heat transfer fluids must have suitable boiling points, dielectric constant and thermal stability for use in the cooling (and in some cases also heating) of electronic components
Implementation Method 3
as boiling point temperatures begin to approach the temperature of the heat sink used to condense the refrigerant
Data Source
AI summary
Non-PFAS compounds useful as refrigerants, and methods of heating and/or cooling of electronic components, articles and/or devices during operation thereof, are disclosed, particularly via immersion cooling by directly or indirectly transferring heat between the electronic component, article and/or device and a refrigerant fluid comprising at least one of (Z)-1,1,2,3,4,4-hexafluorobut-2-ene, (E)-1,1,2,3,4,4-hexafluorobut-2-ene, (Z)-1,2,3,3,4,4-hexafluorobut-1-ene, or (E)-1,2,3,3,4,4-hexafluorobut-1-ene.