Non-Photosensitive Resin for Chemical and Heat Resistance
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Solution Overview
Problem
Existing photosensitive resin compositions used for forming microlenses and protection films are not suitable for processes involving chemical solutions and high temperatures, as they lack chemical resistance and heat resistance, and do not provide adequate planarization properties.
Innovation Solution
A non-photosensitive resin composition comprising self-cross-linkable copolymers with specific structural units, which thermally cross-link to form a cured film with excellent chemical resistance, heat resistance, and planarization properties, suitable for forming protection films, planarizing films, and microlenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photosensitive resin composition is used to form cured film, then the film can be formed through photopolymerization, but the film lacks chemical resistance and heat resistance
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating specific functional groups (carboxyl, hydroxyl, amine groups) and using non-photosensitive polymers instead of traditional photosensitive resin compositions. This parameter change enables the cured film to achieve chemical resistance and heat resistance through thermal curing rather than photopolymerization, directly resolving the contradiction between reliability and ease of manufacture
Solution Approach 2:
The patent creates a composite resin composition by combining non-photosensitive polymer base materials with specific functional additives (compounds containing carboxyl, hydroxyl, or amine groups). This composite approach allows the cured film to simultaneously achieve chemical resistance, heat resistance, and planarization properties while maintaining ease of manufacture through thermal curing processes
2Reliability
If conventional resin composition is used for microlens formation, then the etch back method can be applied, but the resin lacks adequate chemical resistance during device processing
Solution Approach 1:
The patent modifies the chemical parameters of the resin composition by incorporating compounds with specific functional groups (carboxyl, hydroxyl, amine) and using non-photosensitive polymers. These parameter changes enable the resin to withstand chemical processing solutions during device manufacturing while maintaining the precision required for microlens formation through controlled thermal curing and etch back processes
3Reliability
If photosensitive resin is used for protection film, then the film can be formed quickly, but the film deteriorates when exposed to chemical solutions and high temperatures
Solution Approach 1:
The patent fundamentally changes the chemical parameters of the resin system by replacing photosensitive components with non-photosensitive polymers and incorporating functional compounds that provide thermal and chemical stability. This parameter change enables the protection film to maintain its integrity and protective function when exposed to chemical solutions and high temperatures during device processing
Solution Approach 2:
The patent uses a resin composition that can be applied as a temporary protection film during specific processing steps. The film provides necessary protection against chemical solutions and heat, then can be removed after serving its protective purpose, effectively acting as a disposable protection layer that enhances film stability under processing conditions
4Manufacturing precision
If cured film is formed on uneven surface, then planarization is needed for following steps, but conventional resin lacks planarization properties
Solution Approach 1:
The patent changes the rheological and physical parameters of the resin composition by incorporating specific polymers and functional compounds that provide flow and leveling characteristics. These parameter changes enable the resin to automatically planarize uneven surfaces during the coating and curing process, achieving high manufacturing precision without requiring additional planarization processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-photosensitive resin composition significantly reduces the risk of deterioration or damage from chemical solutions and high temperatures, ensuring the integrity and performance of microlenses and protection films, while maintaining high transparency and planarization properties.
Implementation Method 1
Self-cross-linkable copolymers contained in the non-photosensitive resin composition of the present invention are thermally cross-linked with each other without any cross-linkers so as to form a cured film
Implementation Method 2
the resist pattern is reflowed by a thermal treatment to form a lens pattern
Data Source
AI summary
A non-photosensitive resin composition including: a self-cross-linkable copolymer having structural units of Formulae (1) and (2):wherein each R0 is independently a hydrogen atom or methyl group; X is an —O— group or an —NH— group; R1 is a single bond or a C1-6 alkylene group; R2 is a C1-6 alkyl group; a is an integer of 1 to 5, b is an integer of 0 to 4, and when a and b satisfy 1≦a+b≦5, and b is 2, 3, or 4, such R2 optionally differ from each other; R3 is a divalent organic group of Formula (I), Formula (II), or Formula (III), and R4 is an organic group having an epoxy group:wherein c is an integer of 0 to 3, d is an integer of 1 to 3, and each e is independently an integer of 2 to 6; and a solvent.