Non-Planar Contact Interface for Semiconductor Plug Wiring Reliability
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Solution Overview
Problem
In semiconductor devices, the miniaturization leads to difficulties in reliably coupling plug conductive layers with wiring layers, as the relative wiring height increases with smaller line widths, causing wiring instability and increased likelihood of wire fall.
Innovation Solution
A contact conductive layer is formed to contact both the upper and side surfaces of the plug conductive layer, creating a non-planar interface, which allows for reliable electrical coupling with the wiring layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the line width is reduced for miniaturization, then the device size is reduced, but the coupling reliability between plug conductive layer and wiring layer deteriorates
Solution Approach 1:
The contact conductive layer extends not only horizontally but also vertically to contact both the upper surface and side surface of the plug conductive layer. This three-dimensional contact structure compensates for the reduced line width by utilizing the vertical dimension to maintain adequate contact area and coupling reliability despite miniaturization.
Solution Approach 2:
The contact conductive layer is formed with a curved upper surface that conforms to the shape of the plug conductive layer, creating a non-planar interface. This curved configuration increases the contact area between the contact conductive layer and plug conductive layer, thereby improving coupling reliability in miniaturized devices.
2Volume of moving object
If the line width is reduced for miniaturization, then the device size is reduced, but the wiring stability deteriorates due to increased relative wiring height
Solution Approach 1:
By extending the contact conductive layer vertically to contact the side surface of the plug conductive layer, the structure provides additional lateral support for the wiring layer. This vertical extension effectively reduces the relative wiring height and improves wiring stability in miniaturized devices.
3Ease of manufacture
If a planar interface is used between plug conductive layer and contact conductive layer, then the manufacturing process is simpler, but the coupling reliability is insufficient for miniaturized devices
Solution Approach 1:
The contact conductive layer is formed with a curved upper surface that contacts both the upper surface and side surface of the plug conductive layer. This non-planar interface configuration increases the contact area and improves coupling reliability while remaining compatible with standard semiconductor manufacturing processes.
Data Source
AI summary
A semiconductor device is provided, in which it becomes easy to reliably couple a plug conductive layer and a wiring layer located over the plug conductive layer to each other and falling of the wiring can be suppressed. The plug conductive layer contacts a source/drain region formed over a major surface of the semiconductor substrate. A contact conductive layer is formed so as to contact both the upper surface and the side surface of the plug conductive layer. Wiring layers are formed over the contact conductive layer so as to be electrically coupled to the contact conductive layer.