Non-Rectangular Electronic Substrates and Dies for Space Utilization

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Solution Overview

Problem

The challenge lies in efficiently fitting rectangular-shaped electronic components into non-rectangular device form factors, leading to inefficient use of space and increased warpage during mounting, which results in solder joint failures and reduced reliability.

Innovation Solution

The use of non-rectangular shaped electronic device substrates and dies with complementary perimeter shapes allows for improved space utilization, reduced warpage, and enhanced reliability by maximizing perimeter length and distributing load effectively, thereby minimizing solder joint stresses and improving I/O routing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If rectangular-shaped electronic components are used in non-rectangular device form factors, then manufacturing and assembly are simplified, but space utilization becomes inefficient and warpage increases

Engineering Contradiction:

Improvemanufacturing and assembly simplicityVSAvoidspace utilization efficiency

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent applies asymmetry by designing electronic components with non-rectangular shapes (such as L-shaped, U-shaped, or irregular polygons) that complement the non-rectangular device form factor. This allows the components to fit efficiently into the available space while maintaining manufacturability through standardized fabrication processes adapted to the new geometries.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent changes the geometric parameters of electronic components from traditional rectangular shapes to various non-rectangular configurations. This includes modifying perimeter length, area, and corner configurations to optimize space utilization while controlling warpage through adjusted aspect ratios and distributed corner placements.

Inventive Principle:

Principle #35Parameter changes

2Quantity of substance

If rectangular electronic components are mounted in non-rectangular devices, then component availability is maintained, but warpage increases leading to solder joint failures

Engineering Contradiction:

Improvecomponent availabilityVSAvoidsolder joint reliability

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent uses asymmetric corner distributions in non-rectangular component designs to balance thermal and mechanical stresses during mounting. By strategically placing corners at specific locations, the design distributes warpage stresses more evenly across solder joints, preventing concentrated stress points that lead to failures.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent employs curved or rounded corner designs in non-rectangular components to reduce stress concentration compared to sharp rectangular corners. This curvature helps distribute mechanical and thermal stresses more uniformly, reducing the likelihood of solder joint failures during mounting and operation.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Area of stationary object

If non-rectangular shaped components are used, then space utilization and reliability improve, but manufacturing complexity increases

Engineering Contradiction:

Improvespace utilization efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing complex non-rectangular component designs into simpler geometric segments that can be manufactured using standard fabrication techniques. This allows complex shapes to be built from simpler, more manufacturable elements while maintaining the overall non-rectangular configuration for optimal space utilization.

Inventive Principle:

Principle #1Segmentation

4Ease of manufacture

If rectangular components are used, then manufacturing processes are standard, but perimeter length is insufficient for optimal I/O routing

Engineering Contradiction:

Improvestandard manufacturing processesVSAvoidperimeter length for I/O routing

Core Design Contradiction:

Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent uses non-rectangular shapes with extended perimeters achieved through asymmetric configurations. These designs provide additional perimeter length for I/O routing while maintaining compatibility with standard manufacturing processes by using modified versions of existing fabrication techniques.

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS10090259B2Non-rectangular electronic device components

Publication Date: 2018.10.02 INTEL CORP

AI summary

Electronic device shape configuration technology is disclosed. In an example, an electronic device substrate is provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. An electronic device die is also provided that can comprise a top surface, and a bottom surface opposing the top surface. The top surface and/or the bottom surface can have a non-rectangular shaped perimeter. In addition, an electronic device package is provided that can comprise a substrate having a top surface configured to receive a die and a bottom surface opposing the top surface. The package can also include a die having a top surface and a bottom surface opposing the top surface. The die can be coupled to the top surface of the substrate. The top surface and/or the bottom surface of either the substrate, or the die, or both can have a non-rectangular shaped perimeter.