Non-RF-Coupling Tile for Compact Enclosure RF Shielding
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Solution Overview
Problem
Existing RF systems face challenges with RF power coupling to grounded enclosure walls, leading to performance issues and the need for larger enclosures due to minimum separation distances, which is often not feasible in confined spaces.
Innovation Solution
A selected reject band non-RF-coupling tile comprising a ground plate, planar inductor, and conductive via structure on a printed circuit board, designed to block and reflect RF signals, allowing for reduced enclosure sizes by preventing RF field coupling with grounded walls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the minimum separation distance is increased to avoid RF coupling, then RF performance is improved, but enclosure size increases
Solution Approach 1:
The patent introduces a non-RF-coupling tile as an intermediary component positioned between the RF circuitry and the grounded enclosure wall. This tile includes a ground plate, dielectric material, and conductive elements that create an intermediate grounding structure, allowing the RF circuitry to be positioned closer to the enclosure wall while maintaining RF performance through controlled impedance and RF signal redirection.
Solution Approach 2:
The invention transitions from a one-dimensional separation distance approach to a multi-dimensional solution by incorporating vertical layering (ground plate, dielectric material, conductive elements through vias) and angular RF signal redirection. This dimensional approach allows space optimization while maintaining RF performance.
2Volume of stationary object
If the enclosure size is reduced, then space utilization is improved, but RF coupling to walls increases
Solution Approach 1:
The non-RF-coupling tile serves as a mediator that prevents harmful RF coupling while allowing compact enclosure design. The ground plate and conductive elements create an intermediate structure that intercepts and redirects RF signals away from the enclosure wall, eliminating the need for large separation distances.
Solution Approach 2:
The invention converts the potentially harmful RF coupling effect into a beneficial outcome by using the ground plate and conductive elements to intentionally create controlled RF signal paths that redirect RF energy away from the enclosure wall, transforming what would be a harmful coupling effect into a useful signal management mechanism.
3Volume of stationary object
If RF circuitry is positioned close to enclosure walls, then enclosure size is reduced, but RF power loss increases
Solution Approach 1:
The non-RF-coupling tile acts as an intermediary that prevents direct RF power coupling to the enclosure wall. The ground plate and conductive elements create a controlled impedance structure that guides RF signals along intended paths, preventing energy loss through unwanted coupling while allowing close positioning of RF circuitry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively attenuates RF fields at specific frequencies, reducing enclosure sizes and minimizing RF interference, thereby optimizing space utilization and performance.
Implementation Method 1
A selected reject band non-RF-coupling tile comprising a ground plate, planar inductor, and conductive via structure on a printed circuit board, designed to block and reflect RF signals
Implementation Method 2
The conductive via structure is electrically connected to the planar inductor near an interior end of the planar inductor. The conductive via structure is also electrically connected the ground plate.
Implementation Method 3
A selected reject band non-RF-coupling enclosure includes an enclosure wall formed of electrically conductive material. The enclosure wall is electrically connected to a reference ground potential.
Data Source
AI summary
A selected reject band non-RF-coupling tile includes a ground plate disposed on a first side of a printed circuit board. The selected reject band non-RF-coupling tile also includes a planar inductor disposed on a second side of the printed circuit board. The selected reject band non-RF-coupling tile also includes a conductive via structure extending through the printed circuit board. The conductive via structure electrically connects to both the ground plate and the planar inductor at a location near an interior end of the planar inductor. The selected reject band non-RF-coupling tile is used to shield enclosure walls and/or other electrical circuitry from RF fields. The selected reject band non-RF-coupling tile is also used to encapsulate an RF carrying component to block RF fields that emanate from the RF carrying component.