Non-Rigid Transfer Pad With Deformable Pillars for Uniform Contact Pressure
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Solution Overview
Problem
Existing transfer technologies for thin film devices face challenges in applying uniform contact pressure due to machining errors, substrate warpage, and height non-uniformity, leading to device damage or incomplete transfer.
Innovation Solution
A non-rigid pad with deformable pillars is used between the transfer film and pressing unit or target substrate, allowing uniform contact pressure by bending and deforming to accommodate varying pressures and substrate irregularities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a hard surface transfer apparatus is used, then the structural stability is improved, but the contact uniformity deteriorates due to inability to adapt to thickness differences and substrate curvature
Solution Approach 1:
The patent employs a flexible pressing unit made of elastomeric material that can deform to conform to the contours of the substrate and devices. This flexibility allows the pressing unit to maintain uniform contact pressure across the entire surface, adapting to thickness variations and substrate curvature that rigid surfaces cannot accommodate.
Solution Approach 2:
The patent changes the physical parameter of the pressing unit from rigid to elastomeric, which allows the material to dynamically adjust its shape and pressure distribution. This parameter change enables the system to compensate for manufacturing tolerances and substrate irregularities, achieving uniform contact pressure without requiring extremely precise manufacturing.
2Adaptability or versatility
If a very low elastic modulus material is used for the transfer apparatus, then the contact adaptability is improved, but the pressing force control deteriorates
Solution Approach 1:
The patent selects elastomeric materials with specific elastic modulus values that balance flexibility and force control. By carefully choosing materials within a specific elastic modulus range, the pressing unit achieves sufficient softness to adapt to surface variations while maintaining adequate stiffness to transmit and control the pressing force effectively.
Solution Approach 2:
The patent may utilize composite elastomeric structures or layered materials that combine different elastic modulus characteristics. This allows the pressing unit to exhibit depth-dependent mechanical properties, being softer at the contact surface for adaptability while maintaining structural integrity and force control capability in the bulk material.
3Reliability
If uniform contact pressure is applied to transfer all devices, then the transfer completeness is improved, but the device damage risk increases due to excessive pressure on thicker devices
Solution Approach 1:
The elastomeric pressing unit changes its local pressure distribution based on the thickness of individual devices. Thinner devices experience higher contact pressure that enables complete transfer, while thicker devices experience reduced pressure that prevents damage. This automatic pressure modulation occurs through the elastic deformation of the pressing unit material.
Solution Approach 2:
The pressing unit exhibits spatially varying contact pressure, with the local pressure magnitude depending on the local device thickness. This local quality adjustment ensures that each device receives the appropriate pressure level for its specific characteristics, optimizing both transfer completeness and damage prevention.
4Manufacturing precision
If machining tolerances and assembly tolerances are reduced to improve contact uniformity, then the contact precision is improved, but the manufacturing cost increases
Solution Approach 1:
The patent changes the fundamental approach from achieving precision through tight manufacturing tolerances to achieving precision through material compliance. The elastomeric pressing unit inherently compensates for machining and assembly tolerances, allowing the use of standard, cost-effective manufacturing processes while still achieving uniform contact pressure.
Solution Approach 2:
The elastomeric pressing unit acts as an intermediary between the rigid drive mechanism and the devices/substrate. It absorbs and compensates for the effects of manufacturing tolerances and assembly variations, isolating the final contact interface from the imprecisions of upstream components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-rigid pad ensures stable and effective transfer of devices by maintaining constant load over a specific displacement range, overcoming non-uniformity issues and preventing device damage.
Implementation Method 1
multiple pillars 120 each protruding from one surface of the base plate 110 with one end thereof connected to the one surface of the base plate, the pillars being bent and deformed upon application of external force
Implementation Method 2
a transfer film 30 to which multiple devices 20 to be transferred to a target substrate 10 are adhesively attached
Implementation Method 3
a pressing unit 40 providing pressing force to transfer the multiple devices 20 to the target substrate 10
Data Source
AI summary
Disclosed herein are a non-rigid pad for device transfer, which allows uniform contact pressure to be applied between multiple devices and a target substrate to which the devices are to be transferred, a method of manufacturing the same, and a non-rigid pad group for device transfer including the same. The non-rigid pad includes: a base plate; and multiple pillars each protruding from one surface of the base plate with one end thereof connected to the one surface of the base plate, the pillars being bent and deformed upon application of external force, wherein the non-rigid pad is disposed between a transfer film to which multiple devices to be transferred to a target substrate are adhesively attached and a pressing unit providing pressing force to transfer the multiple devices to the target substrate, the non-rigid pad being bent and deformed upon application of pressing force by the pressing unit to allow uniform contact pressure to be applied between the multiple devices and the target substrate.