Non-Silicone Lapping Adhesive for Clean Substrate Holding
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Solution Overview
Problem
Existing silicone-based pressure-sensitive adhesives used in lapping steps for microelectronic device substrates tend to swell or leach, causing contamination and adverse effects on the substrates and lapping equipment.
Innovation Solution
The use of non-silicone-based pressure-sensitive adhesives, such as polyacrylate or polyurethane materials, that do not require silicone-based adhesive materials and exhibit specific mechanical and adhesive properties, such as elastic modulus, tan delta, peel force, and chemical resistance, to securely hold microelectronic device substrates during the lapping process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silicone-based pressure-sensitive adhesives are used to secure substrates during lapping, then the substrate can be securely held, but the adhesive swells or leaches causing contamination of substrates and equipment
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by replacing silicone-based materials with non-silicone alternatives such as polyacrylate or polyurethane. This parameter change maintains the adhesive bonding strength while eliminating the swelling and leaching properties that cause contamination, thus resolving the technical contradiction between strong bonding and contamination-free operation
Solution Approach 2:
The patent employs composite adhesive formulations that combine non-silicone polymers with specific additives to achieve both strong bonding performance and resistance to swelling/leaching. These composite materials integrate multiple functional properties: adhesion to substrate and carrier, mechanical flexibility for lapping, and chemical stability to prevent contamination, thereby simultaneously satisfying both requirements
2Object-generated harmful factors
If non-silicone-based adhesives are used to eliminate contamination, then substrate and equipment remain clean, but achieving the same secure holding strength as silicone-based adhesives becomes challenging
Solution Approach 1:
The patent adjusts key parameters of non-silicone adhesives including molecular weight, crosslink density, and functional group composition to optimize bonding strength. By carefully controlling these parameters, the non-silicone adhesives achieve bonding strength comparable to silicone-based adhesives while maintaining their contamination-free advantage
Solution Approach 2:
The patent applies different non-silicone adhesive formulations to different regions or application scenarios. For example, polyacrylate adhesives may be used where high flexibility is needed, while polyurethane adhesives are applied where higher structural strength is required. This local optimization allows each application to achieve maximum bonding strength appropriate to its specific requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These non-silicone-based adhesives provide a secure and contamination-free lapping process, allowing for precise material removal and desired surface shaping of microelectronic device substrates without the drawbacks associated with silicone-based adhesives.
Implementation Method 1
an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step
Implementation Method 2
The adhesive material can have a Tan Delta in a range from 0.05 to 0.2
Data Source
AI summary
Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.