Non-Silicone Thermal Interface Composition for Low-Density Heat Dissipation
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Solution Overview
Problem
Conventional thermal interface materials face challenges in achieving high thermal conductivity while maintaining low density and avoiding abrasiveness, which is crucial for weight-sensitive applications like electric vehicle battery systems, where they tend to spread or damage equipment.
Innovation Solution
A non-silicone thermally conductive composition comprising a silyl-modified polymer resin, a diluent, and a blend of graphite and non-graphite particles, which is curable to form a soft solid with high thermal conductivity and low density, reducing abrasiveness and enabling efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermally conductive filler particles (aluminum nitride, silicon carbide, aluminum, alumina trihydrate, boron nitride) are used to achieve high thermal conductivity, then thermal conductivity is improved, but cost increases, abrasiveness increases, and hydrolytic stability deteriorates
Solution Approach 1:
The patent uses a composite filler system combining graphite particles with other thermally conductive particles (alumina, aluminum nitride, boron nitride, silicon carbide) in specific weight ratios. This composite approach allows the graphite to reduce abrasiveness while the other particles maintain thermal conductivity, resolving the contradiction between thermal performance and equipment damage.
Solution Approach 2:
The patent changes the particle size parameters of the filler materials, specifically using graphite particles with D50 between 15-150 μm and controlling the D50 of other particles to be less than 33% of the graphite D50. This parameter optimization reduces abrasiveness while maintaining thermal conductivity through improved particle packing and heat transfer pathways.
2Temperature
If highly filled thermal interface materials are used to achieve high thermal conductivity, then thermal conductivity is improved, but density increases, and weight increases
Solution Approach 1:
The patent creates a composite filler system where graphite particles (density 2.2 g/cm³) are combined with other thermally conductive particles in controlled ratios. The graphite particles act as a lower-density framework that maintains thermal conductivity while reducing the overall density compared to conventional high-fill formulations using denser particles like aluminum nitride or boron nitride.
Solution Approach 2:
The patent applies local quality by using larger graphite particles (D50: 15-150 μm) as the primary filler to establish thermal pathways, while using smaller particles (D50 < 33% of graphite D50) to fill interstices. This hierarchical structure achieves high thermal conductivity with reduced overall filler loading, thereby reducing density and weight.
3Ease of operation
If silicone oils are used in thermal interface materials to achieve low dispensing viscosity, then dispensability is improved, but the material spreads on substrate and affects adjacent surfaces
Solution Approach 1:
The patent extracts and eliminates silicone oils from the formulation, replacing them with non-silicone polymer resins (polyester, polyurethane, polyacrylate, or polyisoprene). This removal of the problematic silicone component eliminates the spreading issue while maintaining dispensability through careful selection of polymer viscosity and crosslinking chemistry.
Solution Approach 2:
The patent changes the chemical composition parameters by using non-silicone polymers with specific molecular weights and viscosities, combined with crosslinking agents that provide controlled curing. This parameter change eliminates the low surface tension effect of silicones that causes spreading, while maintaining appropriate pre-cure flow characteristics for dispensing.
4Object-generated harmful factors
If conventional non-silicone polymers are used to avoid silicone bleeding, then spreading is reduced, but achieving suitable combination of temperature stability, pre-cure viscosity, and post-cure hardness becomes challenging
Solution Approach 1:
The patent creates a composite polymer system combining non-silicone resin base polymers (polyester, polyurethane, polyacrylate, or polyisoprene) with crosslinking agents and silyl-modified components. This composite formulation achieves the desired balance of temperature stability, pre-cure viscosity, and post-cure hardness through synergistic interactions between components, avoiding the need to optimize a single polymer.
Solution Approach 2:
The patent introduces silyl-modified polymer resins as intermediaries that bridge the non-silicone polymer matrix and the crosslinking chemistry. These silyl-modified components provide controlled reactivity for curing while maintaining compatibility with the non-silicone base, enabling tuning of pre-cure viscosity and post-cure properties without returning to silicone-based systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a thermal conductivity of at least 1.5 W/m*K with a density of less than 2.4 g/cm3, providing effective heat dissipation and minimizing equipment damage, while being suitable for use in electric vehicle battery systems.
Implementation Method 1
The silyl-modified non-silicone polymer resin may be condensation-curable
Implementation Method 2
particulate filler that includes 30-70 wt. % graphite particles having an average particle size of between 15 μm and 150 μm and balance wt. % non-graphite particles having an average particle size that is less than 33% of the graphite average particle size. The thermally conductive composition exhibits a density of less than 2.4 g/cm3 and a thermal conductivity of at least 1.5 W/m*K
Data Source
AI summary
A thermally conductive composition includes a non-silicone polymer resin curable in place along a thermal dissipation pathway. The composition exhibits a low density for particular use in weight-sensitive applications that require a thermal conductivity of at least 1.5 W/m*K.