Non-Substrate Adhesive Tape Composition for High-Temperature Shear
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Solution Overview
Problem
Existing substrate-free adhesive tapes face challenges with high-temperature shear characteristics and adhesive strength, and they are not suitable for continuous manufacturing processes without a separate stamping process.
Innovation Solution
An adhesive composition comprising an acrylic copolymer formed by copolymerizing alkyl group-containing, cyclic substituent-containing, polar group-containing, and specific (meth)acrylate monomers, including those represented by Formula 1, which enhances shear properties and adhesive strength, suitable for continuous processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If substrate-free adhesive tape is used to reduce adhesive layer thickness, then device thickness is reduced, but high-temperature shear characteristic and adhesive strength deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by incorporating specific monomers (cyclic substituent-containing (meth)acrylate monomer and hetero cycloalkyl group-containing (meth)acrylate monomer) in controlled ratios. This chemical parameter modification enables the thin adhesive layer to achieve both reduced thickness and maintained high-temperature shear strength, resolving the contradiction between thickness reduction and strength maintenance.
Solution Approach 2:
The patent creates a composite adhesive material by combining multiple (meth)acrylate monomers with different functional groups (alkyl, cyclic, hetero cycloalkyl, and polar groups). This composite approach allows the adhesive layer to simultaneously achieve thinness and high-temperature durability through the synergistic effects of different monomer units working together.
2Productivity
If substrate-free adhesive tape is applied to continuous process, then manufacturing efficiency should improve, but separate stamping process is required which deteriorates continuous process efficiency
Solution Approach 1:
The patent extracts and eliminates the separate stamping process from the production workflow by designing an adhesive layer with inherent self-alignment and self-adhesion properties. The specific monomer composition enables the adhesive tape to be directly applied and bonded without requiring additional stamping operations, thereby removing process complexity and improving continuous manufacturing efficiency.
Solution Approach 2:
The adhesive layer is designed to perform its own bonding function without external assistance from stamping or additional processing steps. The chemical composition provides self-aligning and self-adhesive characteristics that enable direct application to substrates, making the system self-sufficient and eliminating the need for separate stamping processes in continuous manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition provides an adhesive layer with excellent shear characteristics and strength, enabling stable application in continuous processes without a separate stamping process, maintaining adhesion even at high temperatures.
Implementation Method 1
an acrylic copolymer in which a monomer mixture including: an alkyl group-containing (meth)acrylate monomer; a cyclic substituent-containing (meth)acrylate monomer including at least one of a cycloalkyl group-containing (meth)acrylate monomer and a hetero cycloalkyl group-containing (meth)acrylate monomer; a polar group-containing (meth)acrylate monomer wherein the polar functional group-containing monomer includes at least one of a carboxyl group-containing monomer, and a nitrogen-containing monomer; and a (meth)acrylate monomer represented by the following Formula 1 is copolymerized
Data Source
Figure 1
Figure 2(A)~2(C)
Figure 3
AI summary
The present invention relates to a substrate-free adhesive tape which is easily applied to a continuous process due to an excellent adhesive strength and a short fracture distance, and an adhesive composition capable of implementing the same.