Non-transferable RFID Tag with Adhesive Modification Layer
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Solution Overview
Problem
Conventional RFID tags can be easily removed from one item and reattached to another, leading to issues with counterfeit identification and tampering detection.
Innovation Solution
A non-transferable RFID assembly with a conductive layer and adhesive modification layer configuration that remains intact and functional when attached to an item, preventing removal and reattachment by causing the substrate to release, thereby indicating tampering attempts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional RFID tags are made removable for ease of application, then ease of operation is improved, but reliability deteriorates due to unauthorized transfer and tampering
Solution Approach 1:
The adhesive modification layer is pre-configured with a release mechanism that activates upon removal attempt. The layer contains a release agent or structural feature that causes the substrate to detach and leave the conductive layer intact on the article, preventing tag transfer before it can occur
Solution Approach 2:
The adhesive modification layer serves as an intermediary between the substrate and conductive layer. It mediates the interaction by providing controlled adhesion that releases under removal force, allowing the conductive layer to remain on the article while the substrate detaches, thus preventing unauthorized transfer
2Reliability
If RFID tags are made non-transferable through adhesive modification, then reliability is improved, but device complexity increases due to additional layers and configuration
Solution Approach 1:
Instead of modifying the entire tag structure, only the adhesive layer is modified with specific properties or additions (such as release agents or structural changes). This localized modification achieves the non-transferable function without requiring changes to the RFID module, antenna, or other major components, thus minimizing overall device complexity
Solution Approach 2:
The adhesive modification layer uses composite material structures, combining adhesive properties with release mechanisms or structural features. This composite approach enables the layer to provide both adhesion during normal use and controlled release upon removal attempt, achieving anti-tamper functionality through material composition rather than complex mechanical structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The RFID assembly maintains its functionality and integrity when attached to an item, preventing unauthorized transfer and allowing for tampering detection, ensuring secure identification of the original item.
Implementation Method 1
an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact
Data Source
AI summary
A Non-transferable Radio Frequency Identification (RFID) assembly for attachment to an article comprises a RFID module; and a antenna module coupled with the RFID module, the antenna module comprising a conductive layer, a substrate, and an adhesive modification layer between the conductive layer and the substrate, the adhesive modification layer configured such that when the assembly is attached to the article and attempt to remove the assembly will cause the substrate to release and leave the conductive layer intact.