Non-Flat Substrate Motion for Uniform Sputter Coating
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Solution Overview
Problem
Current sputter coating devices are inadequate for achieving highly uniform non-circumferential coatings on non-flat substrates, as they often result in coating uniformity limited by the substrate's shape, and existing solutions either restrict coating to uniform areas or require complex and challenging vacuum maintenance systems.
Innovation Solution
A movement system that translates and rotates non-flat substrates across a sputter flux distribution, allowing for controlled adjustment of substrate orientation and distance relative to the sputter flux, combined with a sputter system that can adjust its flux distribution, to achieve uniform non-circumferential coatings without requiring extensive movement of the sputter system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional sputter coating devices are used on non-flat substrates, then the coating process can be performed, but the coating uniformity is limited by the substrate's shape and cannot achieve highly uniform non-circumferential coatings
Solution Approach 1:
The substrate is dynamically moved through the sputter flux distribution using a movement system that translates and rotates the substrate during coating. This dynamic positioning allows different areas of the non-flat substrate to be exposed to the sputter flux at different times and angles, achieving uniform coating thickness across the entire substrate surface rather than being constrained by the static flux distribution pattern.
Solution Approach 2:
The invention introduces temporal and angular dimensions to the coating process by moving the substrate through space and time. Instead of a static coating configuration, the substrate undergoes complex trajectories including translation and rotation, effectively adding dimensional control to compensate for the substrate's non-flat geometry and achieve uniform coating deposition.
2Manufacturing precision
If masks are used to restrict coating to uniform areas, then coating uniformity can be maintained in those areas, but other areas that also need coating are excluded
Solution Approach 1:
Instead of using masks to statically restrict coating to specific areas, the invention employs dynamic substrate movement to bring different areas of the substrate sequentially into the optimal coating position. This allows the entire substrate surface to be coated uniformly without requiring masks, thereby maintaining both coating uniformity and full area coverage.
3Manufacturing precision
If the sputter system is moved to accommodate complex non-flat substrates, then coating uniformity can be improved, but vacuum maintenance becomes exceedingly demanding
Solution Approach 1:
Instead of moving the sputter system to accommodate the substrate shape, the invention inverts the approach by moving the substrate through the stationary sputter flux distribution. This inversion maintains the simplicity of the vacuum system while achieving the same coating uniformity through substrate movement and positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables uniform non-circumferential coatings with a local layer thickness variation of 15% or less, improving coating uniformity while maintaining the sputter system in a fixed position and reducing vacuum maintenance challenges.
Implementation Method 1
sputter flux distribution
Data Source
AI summary
A movement system is provided for moving a non-flat substrate across a sputter flux distribution without circumferentially exposing the non-flat substrate to the sputter flux distribution. The movement system is arranged for a first movement of translationally transporting the non-flat substrate along the sputter flux distribution, and a second movement of translating and/or rotating the non-flat substrate with respect to the sputter flux distribution.