Non-ionic Resist Composition for Microelectronics
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Solution Overview
Problem
Current resist compositions for pattern formation in microelectronics face challenges in achieving precise resolution and dry-etching tolerance due to limitations in acid-labile groups and fluorine-containing compounds, which affect the stability and etching resistance of the resist patterns.
Innovation Solution
A non-ionic compound with specific structural units, including a C3 to C18 alicyclic hydrocarbon group and perfluoroalkyl groups, is incorporated into a resin, combined with an acid-labile group and an acid generator, to form a resist composition that enhances resolution and dry-etching tolerance through controlled acid generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist compositions use traditional acid-labile groups and fluorine-containing compounds, then the resist patterns achieve basic etching resistance, but the resolution and dry-etching tolerance are insufficient
Solution Approach 1:
The patent uses a composite resin structure combining polycyclic structures (adamantyl, cyclohexyl groups) with perfluoroalkyl chains and carboxylic acid groups. This composite material approach creates a multi-functional resin that simultaneously provides high resolution through the rigid polycyclic core and enhanced dry-etching tolerance through the perfluoroalkyl chains and acid-labile carboxylic acid groups, resolving the contradiction between resolution and etching tolerance
Solution Approach 2:
The patent modifies the chemical parameters of the resist composition by introducing specific perfluoroalkyl chains (C1-C4) and controlling the ratio of polycyclic structures to acid-labile groups. These parameter changes optimize the balance between resolution (improved by rigid polycyclic structures) and dry-etching tolerance (improved by perfluoroalkyl chains and acid generation), allowing simultaneous achievement of both requirements
2Reliability
If the resist composition enhances etching resistance through fluorine-containing compounds, then dry-etching tolerance improves, but pattern resolution deteriorates
Solution Approach 1:
The patent applies local quality by positioning perfluoroalkyl chains specifically in the side chains of the resin structure, while maintaining rigid polycyclic structures (adamantyl, cyclohexyl) in the main chain. This spatial differentiation allows the perfluoroalkyl groups to provide etching resistance locally without compromising the overall resolution provided by the rigid backbone structure
Solution Approach 2:
The resin structure is segmented into distinct functional regions: rigid polycyclic cores for resolution, perfluoroalkyl chains for etching resistance, and carboxylic acid groups for acid-labile functionality. This segmentation allows each component to perform its specific function optimally without interfering with the others, resolving the contradiction between etching resistance and resolution
3Manufacturing precision
If the resist composition uses acid-labile groups for pattern formation, then resolution improves, but stability during storage and processing deteriorates
Solution Approach 1:
The patent incorporates stable polycyclic structures (adamantyl, cyclohexyl groups) as a protective framework that cushions and stabilizes the acid-labile carboxylic acid groups during storage and processing. This prior cushioning through rigid structural elements prevents premature degradation of the acid-labile groups while maintaining their reactivity during the intended exposure and development process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition improves pattern resolution and dry-etching tolerance, providing better stability and etching resistance, enabling more precise microelectronic pattern formation.
Implementation Method 1
exposing the composition layer; heating the exposed composition layer
Data Source
AI summary
A compound which is non-ionic compound, the compound has a group represented by formula (Ia):wherein R2 represents a group having a C3 to C18 alicyclic hydrocarbon group where a methylene group may be replaced by an oxygen atom or a carbonyl group, Rf1 and Rf2 each independently represent a C1 to C4 perfluoroalkyl group, and * represents a binding site.