Non-linear Coaxial Wire Traces for High-Density Interconnects
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Solution Overview
Problem
Conventional interconnect structures, such as those in printed circuit boards and interposers, are limited to straight coaxial wires, which restricts their ability to accommodate higher pin counts and denser chip configurations, leading to increased latency and impedance.
Innovation Solution
A method is developed to form coaxial wires with non-linear geometries using a sacrificial trace structure and additive manufacturing, where a continuous seed metal layer is formed, followed by the deposition of interconnect metal layers and encapsulation with a dielectric material, allowing the wires to extend through the dielectric structure with exposed ends.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional interconnect structures use straight coaxial wires, then manufacturing is simpler, but packing density and signal performance deteriorate due to increased latency and impedance
Solution Approach 1:
The patent applies curvature to coaxial wire traces, allowing them to follow non-linear pathways through the substrate. This enables wires to route around obstacles and achieve higher packing density without requiring straight-line connections, thereby improving productivity while maintaining manufacturing feasibility through standard PCB routing techniques
2Ease of manufacture
If conventional interconnect structures use straight coaxial wires, then manufacturing is simpler, but signal performance deteriorates due to increased latency and impedance
Solution Approach 1:
By allowing coaxial wires to follow curved non-linear pathways, the patent reduces the effective transmission distance compared to straight-line routing around obstacles. This curvature approach minimizes latency and maintains signal integrity, improving reliability while still using conventional manufacturing methods
3Productivity
If additive manufacturing is used to form coaxial wires with non-linear geometries, then packing density and signal performance improve, but manufacturing complexity increases
Solution Approach 1:
The patent uses preliminary sacrificial structures formed through additive manufacturing to define the geometry of coaxial wires. These sacrificial elements are created first, then coated with conductive material, and finally removed to leave the desired wire geometry. This preliminary action enables complex non-linear pathways while using standard PCB manufacturing processes for the actual wire formation, thereby improving packing density without proportionally increasing manufacturing complexity
4Reliability
If additive manufacturing is used to form coaxial wires with non-linear geometries, then signal performance improves by reducing latency and impedance, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary sacrificial structures formed through additive manufacturing to define the geometry of coaxial wires. These sacrificial elements are created first, then coated with conductive material, and finally removed to leave the desired wire geometry. This preliminary action enables complex non-linear pathways that reduce latency and impedance, improving signal performance while using standard PCB manufacturing processes for the actual wire formation, thereby limiting the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of coaxial wires with curved and angled pathways, enhancing packing density, reducing latency, and lowering impedance, while being more cost-effective than traditional silicon interposer methods.
Implementation Method 1
The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer
Implementation Method 2
forming a continuous seed metal layer on the sacrificial trace structure
Implementation Method 3
a first interconnect metal layer may be formed on the continuous seed layer
Implementation Method 4
a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly
Data Source
AI summary
A method of forming a coaxial wire that includes providing a sacrificial trace structure using an additive forming method, the sacrificial trace structure having a geometry for the coaxial wire, and forming a continuous seed metal layer on the sacrificial trace structure. The sacrificial trace structure may be removed and a first interconnect metal layer may be formed on the continuous seed layer. An electrically insulative layer may then be formed on the first interconnect metal layer, and a second interconnect metal layer is formed on the electrically insulative layer. Thereafter, a dielectric material is formed on the second interconnect metal layer to encapsulate a majority of an assembly of the first interconnect metal layer, electrically insulative layer and second interconnect metal layer that provides said coaxial wire. Ends of the coaxial wire may be exposed through opposing surfaces of the dielectric material to provide that the coaxial wire extends through that dielectric material.