Non-linear Wiring Member for Semiconductor Module

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Solution Overview

Problem

Conventional semiconductor modules require multiple components and increased connection areas due to the use of copper clips for electrical coupling, leading to higher component counts and reduced packaging density.

Innovation Solution

A wiring member with non-linearly arranged leg portions and connecting walls that electrically couples multiple conductive portions, reducing the number of components and connection points, and providing stability against manufacturing errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple copper clips are used to electrically couple conductive portions, then the electrical coupling is achieved, but the number of components increases and packaging density decreases

Engineering Contradiction:

Improveelectrical coupling reliabilityVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate copper clips into a single integrated wiring member with multiple leg portions. This single wiring member electrically couples three conductive portions (first, second, and third) that would otherwise require two separate clips, thereby reducing component count while maintaining reliable electrical connections

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If multiple clips are connected with conductive adhesive, then electrical coupling is achieved, but the connection area increases

Engineering Contradiction:

Improveelectrical coupling reliabilityVSAvoidconnection area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

By merging multiple connection points into a single integrated wiring member, the total connection area is reduced. The wiring member establishes electrical connections at three locations (first leg to first conductive portion, second leg to second conductive portion, third leg to third conductive portion) without requiring the additional adhesive areas that would be needed to connect multiple separate clips

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If linear arrangement of leg portions is used, then manufacturing is simplified, but stability against height displacement errors is reduced

Engineering Contradiction:

Improvewiring member manufacturingVSAvoidcoupling stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent employs a non-linear (triangular) arrangement of the three leg portions rather than a linear configuration. This asymmetric triangular layout provides stability against height displacement errors because the three connection points form a stable geometric base, making the wiring member less sensitive to variations in the heights of the conductive portions it connects

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS9123711B2Wiring member and semiconductor module having the same

Publication Date: 2015.09.01 DENSO CORP

AI summary

A wiring member includes a first leg portion, a second leg portion, a third leg portion, a first connecting wall and a second connecting wall. The first leg portion is electrically connected to a first conductive portion. The second leg portion is electrically connected to a second conductive portion. The third leg portion is electrically connected to a third conductive portion. The first connecting wall connects the first leg portion and the second leg portion. The second connecting wall connects the second leg portion and the third leg portion. The first leg portion, the second leg portion, and the third leg portion are non-linearly arranged.