Non-Metallic CMP Conditioning Disk Corrosion Resistance
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Solution Overview
Problem
The existing CMP polishing pad conditioning disks with metallic substrates and bonding systems are prone to premature failure due to corrosion from highly acidic polishing slurries, leading to the loss of superabrasive particles and surface deformations in semiconductor wafers.
Innovation Solution
A non-metallic substrate with a monolayer of superabrasive particles bonded using a non-metallic ceramic or silicon carbide bonding system, which is resistant to corrosive acidic slurries and securely holds the abrasive particles, thereby extending the useful life of the conditioning disk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metallic substrate and bonding system are used in CMP conditioning disks, then strong bonding strength is achieved, but premature failure occurs due to corrosion from highly acidic polishing slurries
Solution Approach 1:
The patent changes the material parameter from metallic to non-metallic (ceramic or silicon carbide) for both substrate and bonding system, transforming the chemical properties to achieve resistance against acidic corrosion while maintaining mechanical strength through the inherent properties of these advanced materials
Solution Approach 2:
The patent employs composite material structures where non-metallic bonding materials are applied to non-metallic substrates, creating a corrosion-resistant composite system that combines the advantages of both materials to withstand highly acidic polishing slurries while maintaining bonding strength
2Strength
If braze bonding is used to secure diamond particles, then stronger bond between particles and substrate is achieved, but diamond particles may still loosen and fall free causing wafer deformations
Solution Approach 1:
The patent changes the bonding mechanism from metallic braze bonding to non-metallic bonding, fundamentally altering the chemical and physical properties of the bond to prevent particle loosening and elimination of harmful effects on wafers
Solution Approach 2:
The patent employs a bonding system designed to maintain particle security throughout the service life of the conditioning disk, preventing premature particle loss that would require frequent disk replacement and cause wafer defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-metallic CMP conditioning disk effectively resists corrosion and maintains the retention of superabrasive particles, ensuring precise planarization of semiconductor wafers without the premature loss of abrasive particles, comparable to or exceeding the performance of metallic bonded disks.
Implementation Method 1
A non-metallic substrate with a monolayer of superabrasive particles bonded using a non-metallic ceramic or silicon carbide bonding system, which is resistant to corrosive acidic slurries
Implementation Method 2
securely holds the abrasive particles, thereby extending the useful life of the conditioning disk
Data Source
AI summary
A conditioning tool (10) for restoring a used non-metallic CMP polishing pad comprising a non-metallic substrate (20) and a single layer of abrasive particles (24) bonded to the substrate (20) by a non-metallic bonding medium (22). Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.