Non-Planar Bonding Head for Void-Free 3D IC Package Bonding

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Solution Overview

Problem

Existing processing apparatuses for 3D IC bonding fail to adequately minimize voids or gaps between package components, affecting the quality and reliability of the formed package structures.

Innovation Solution

A processing apparatus with a bonding head featuring a non-planar, deformable bottom surface that conforms to the package components, allowing them to be deformed and bonded from the center to the edges, minimizing gaps and enhancing the bonding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a planar bonding head is used for bonding package components, then the bonding process is simple, but voids or gaps form between package components reducing quality and reliability

Engineering Contradiction:

Improvepackage structure qualityVSAvoidbonding head structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The bonding head bottom surface is designed with a non-planar, curved profile that complements the package component shape. This curvature allows the bonding head to conform to the package component geometry, enabling complete surface contact from center to edges and eliminating voids or gaps that would form with a planar bonding head.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The bonding head features a non-uniform bottom surface with different regions having different curvatures or profiles. This local variation in geometry allows specific areas of the bonding head to match corresponding areas of the package component, ensuring optimal contact pressure distribution and eliminating voids in critical bonding regions.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If package components are bonded from center to edges, then voids are minimized, but the bonding process becomes more complex

Engineering Contradiction:

Improvecontact uniformityVSAvoidbonding process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The curved bottom surface of the bonding head naturally guides the bonding process from the center region to the edges. The geometric profile ensures that center contact occurs first, followed by progressive edge contact, achieving uniform compression without requiring complex multi-step bonding procedures.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The bonding head geometry is pre-configured to establish the correct contact sequence before bonding begins. The non-planar profile is designed in advance to ensure that when pressure is applied, the center region contacts the package component first, followed by the edges, automatically achieving uniform bonding without complex process control.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20250253184A1Processing apparatus and method for forming package structure

Publication Date: 2025.08.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A processing apparatus for forming a package structure is provided. The processing apparatus includes a processing chamber for bonding a first package component and a second package component. The processing apparatus includes a bonding head that is disposed in the processing chamber for holding the second package component. The processing apparatus also includes a chuck table that is disposed in the processing chamber for holding the first package component. The bonding head has a bottom surface facing a top surface of the chuck table, and the bottom surface of the bonding head is a non-planar surface.