Non-Planar Pad Interposer Layout for Reliable Electronic Bonding
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Solution Overview
Problem
Current electronic components placed on curved substrates face stress concentration issues due to asymmetrical mechanical stress, leading to poor electrical connections and potential damage to the components.
Innovation Solution
The electronic device incorporates a substrate with non-planar bonding surfaces and electronic components with corresponding pads, utilizing conductive interposing layers with thickness differences to compensate for height differences between the pads, thereby reducing stress differences on the bonding surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are placed on non-planar substrates to achieve 3D deformability and flexibility, then design flexibility is improved, but stress concentration occurs due to asymmetrical mechanical stress leading to poor electrical connections and component damage
Solution Approach 1:
The patent applies local quality by creating different thicknesses of conductive interposing layers at different locations. The first conductive interposing layer has a first thickness and the second conductive interposing layer has a second thickness that is different from the first thickness. This local variation in thickness compensates for the height difference between pads on non-planar substrates, ensuring uniform stress distribution and reliable electrical connections across the curved surface.
2Reliability
If conductive interposing layers with thickness differences are used to compensate for height differences between pads, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the conductive interposing layers with the substrate structure, where the interposing layers are integrated directly into the substrate assembly. This combining approach reduces the need for separate compensation mechanisms and simplifies the overall device structure while still achieving the function of stress uniformization and reliable electrical connection.
Data Source
AI summary
An electronic device includes a substrate, an electronic component, a first interposing layer and a second interposing layer. The substrate is non-planar and the substrate includes a first substrate pad and a second substrate pad. The electronic component includes a first component pad and a second component pad corresponding to the first substrate pad and the second substrate pad respectively. When the first component pad contacts the first substrate pad, a height difference exists between the second component pad and the second substrate pad. The first interposing layer connects between the first component pad and the first substrate pad. The second interposing layer connects between the second component pad and the second substrate pad. A thickness difference between the first interposing layer and the second interposing layer is 0.5 to 1 time the height difference.