Nonpolymeric Binders for Semiconductor Coatings
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Solution Overview
Problem
Conventional bottom antireflective coatings (B.A.R.C.s) used in semiconductor manufacturing face challenges such as intermixing with photoresist films, sublimation of components during curing, and contamination of equipment, leading to increased production costs and reduced image resolution due to random distribution of functional groups in polymeric binders.
Innovation Solution
The use of nonpolymeric binders (NPBs) in semiconductor coating compositions, which include a chromophore-containing binder, a crosslinking agent, and a solvent, to form thermally-curable bottom antireflective coatings and gap fill compositions with tunable plasma etch rates and improved adhesion, minimizing intermixing and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polymeric binders are used in bottom antireflective coatings, then the coatings can be formed with functional groups for crosslinking and adhesion, but the functional groups are randomly distributed leading to intermixing with photoresist films and reduced image resolution
Solution Approach 1:
The patent changes the fundamental parameter of binder structure from polymeric (with random functional group distribution) to nonpolymeric (with controlled, uniform distribution). This parameter change allows functional groups to be evenly spaced throughout the binder molecule, preventing intermixing with photoresist while maintaining adhesion and crosslinking capabilities, thereby resolving the contradiction between reliability and manufacturing precision
Solution Approach 2:
The patent creates a composite binder structure combining nonpolymeric backbone with integrated functional groups (crosslinking groups, adhesion groups, and chromophores). This composite approach allows each functional group to be strategically positioned rather than randomly distributed, achieving both reliable functionality and precise image resolution by eliminating the randomness inherent in polymeric structures
2Ease of manufacture
If conventional polymeric binders with random functional group distribution are used, then crosslinking and adhesion functions are provided, but intermixing with photoresist occurs and equipment contamination increases
Solution Approach 1:
The patent changes the structural parameter from polymeric to nonpolymeric binder, which fundamentally alters the distribution pattern of functional groups from random to controlled. This parameter change eliminates the harmful effects of intermixing and contamination while preserving the ease of manufacture through maintained crosslinking and adhesion functionality
Solution Approach 2:
The patent applies local quality by strategically positioning different functional groups (crosslinking groups, adhesion groups, chromophores) at specific locations within the nonpolymeric binder structure. This localized arrangement ensures that each functional group performs its intended function without causing intermixing or contamination, resolving the contradiction between ease of manufacture and harmful factors
3Manufacturing precision
If bottom antireflective coatings are used to control reflection, then standing wave effects are reduced, but additional processing steps are required and photoresist etching occurs during B.A.R.C. removal
Solution Approach 1:
The patent changes the chemical composition parameter of the binder from polymeric to nonpolymeric, which fundamentally alters the etch selectivity characteristics. This parameter change enables the B.A.R.C. to achieve superior etch resistance while maintaining thin profile, reducing the need for additional processing steps and minimizing photoresist etching during B.A.R.C. removal, thus resolving the contradiction between manufacturing precision and device complexity
4Loss of substance
If B.A.R.C. thickness is reduced to minimize photoresist etching, then less photoresist is removed during B.A.R.C. removal, but the desired antireflective properties may not be achieved
Solution Approach 1:
The patent changes the binder structure parameter from polymeric to nonpolymeric, which fundamentally improves the etch selectivity and optical properties of the B.A.R.C. This parameter change allows the coating to achieve desired antireflective performance at thinner thicknesses, simultaneously reducing photoresist loss during removal while maintaining reliability of antireflective function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The nonpolymeric binder-based coatings provide excellent substrate adhesion, controllable optical properties, and high resolution relief images with reduced production costs by preventing intermixing and minimizing contamination, while maintaining high etch selectivity and plasma etch rates.
Implementation Method 1
thermally-curable coating compositions comprising novel, nonpolymeric binders... The nonpolymeric binder-based coatings provide excellent substrate adhesion... maintaining high etch selectivity
Implementation Method 2
this is typically done by an oxidative plasma etch step... maintaining high etch selectivity and plasma etch rates
Implementation Method 3
chromophore-containing binder... controllable optical properties
Data Source
AI summary
Semiconductor coating compositions useful as aperture fill compositions and bottom antireflective coatings containing: (1) a nonpolymeric, binder (NPB) represented by formula (Ao), where Q is a multivalent organic nucleus, Z1 and Z11 are divalent linking groups, W is a divalent organic bridging group, theta is an organic DUV chromophore-containing substituent T or an organic substituent schwa having little or no absorbance to DUV light, X is a reactive functional group, Y11 is a reactive functional group, a ranges from about 2 to15, b ranges from about zero to 10, c ranges from about zero to 5, and d is zero or 1, wherein Q, W, and theta together contain at least two groups or sites which are reactive in a crosslinking reaction and with the proviso that the sum of (a+b+c) is greater than or equal to 3. (2) a crosslinking agent; and (3) a solvent.