Non-reciprocal Circuit Device Miniaturization via Lumped-Constant Design

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Solution Overview

Problem

Miniaturization of non-reciprocal circuit devices is challenging due to the size constraints of garnet plates, and positional deviations in components lead to non-uniform magnetic fields and impaired electric characteristics.

Innovation Solution

A non-reciprocal circuit device design featuring a ground plate with external projections, a resin member with a hole for the ground plate, a single garnet plate, a microstrip line member on the garnet plate, and a partition member with a permanent magnet, where the microstrip line member is bonded to the garnet plate using an adhesive resin film, preventing positional deviations and deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If distribution-constant-type non-reciprocal circuit devices are miniaturized, then device size is reduced, but the size of garnet plates cannot be reduced further due to operating frequency constraints

Engineering Contradiction:
Improvedevice sizeVSAvoidgarnet plate size constraint
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The invention transitions from a distribution-constant type structure to a lumped-constant type structure, changing the dimensional approach to achieving miniaturization. By concentrating the magnetic field generation and signal processing functions into discrete lumped elements rather than distributed continuous structures, the device can be significantly reduced in size while maintaining functionality at the operating frequency

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The device is divided into distinct functional segments: a resonator portion for signal processing, a permanent magnet for magnetic field generation, and a garnet plate for non-reciprocal effect. This segmentation allows each component to be optimized independently and contributes to overall miniaturization by eliminating the need for extended distributed structures

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If positional deviation of constituent parts occurs, then assembly is simplified, but the magnetic field becomes non-uniform and electric characteristics deteriorate

Engineering Contradiction:
Improveassembly toleranceVSAvoidmagnetic field uniformity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The resonator portion is designed with predetermined impedance characteristics that compensate for potential positional deviations. The impedance conversion lines are pre-calculated and positioned to ensure that even with manufacturing tolerances, the magnetic field remains sufficiently uniform and electric characteristics are maintained

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention optimizes specific parameters including the impedance of the resonator portion, the dimensions and positioning of impedance conversion lines, and the relationship between the permanent magnet and garnet plate. These parameter adjustments create a design that is tolerant to positional variations while maintaining magnetic field uniformity

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If adhesive is used to bond microstrip line member to garnet plate, then positional deviation is prevented, but adhesive may spread to main surface and form parasitic capacitance

Engineering Contradiction:
Improvepositional accuracyVSAvoidparasitic capacitance
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

A resin member is introduced as an intermediary component between the microstrip line member and the garnet plate. This resin member provides a controlled bonding interface that prevents adhesive from spreading to the main surface of the garnet plate, thereby eliminating parasitic capacitance formation while still ensuring positional accuracy through the structured resin interface

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design allows for a thinner non-reciprocal circuit device without compromising electric characteristics, maintaining bandwidth and preventing positional deviations, even under external forces.

Implementation Method 1

permanent magnets 20, 20 disposed on both sides of the garnet plates 30, 30 for applying a DC magnetic field thereto

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

When current is supplied to the microstrip line member 35, a high-frequency magnetic field is generated from the garnet plate 30

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 3

Because the permanent magnet 20 generates a rotating magnetic field in the garnet plate 30, the polarization plane of the high-frequency magnetic field input to any one of the lines 35a-35c rotates

Methodology Applied
Scientific EffectFaraday effect: Faraday Effect

Data Source

PatentUS8134422B2Non-reciprocal circuit device
Publication Date: 2012.03.13 PROTERIAL LTD
  • US8134422B2 patent drawing
  • US8134422B2 patent drawing
  • US8134422B2 patent drawing

AI summary

A non-reciprocal circuit device comprising a ground plate having pluralities of external projections, a resin member having a hole through which the ground plate is exposed, a garnet plate disposed in the hole of the resin member, a microstrip line member disposed on a main surface of the garnet plate, a partition member disposed on the microstrip line member, and a permanent magnet disposed on the partition member between a pair of metal cases in this order from bottom, at least part of the external projections of the ground plate extending through the hole of the resin member over an upper surface of the partition member, and being bent to enclose the garnet plate, the microstrip line member and the partition member.