Non-Sintered Phosphor Stack for Moisture-Resistant LED Packaging
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Solution Overview
Problem
The use of fluoride phosphor in light-emitting semiconductor packaging is hindered by its sensitivity to moisture, requiring effective moisture resistance and efficient packaging processes that do not involve high-temperature sintering.
Innovation Solution
A non-sintered stacked device preparation method using a base layer and stacked layer mixed materials, comprising silicones, inhibitors, and phosphors, which are coated and cured at lower temperatures, achieving moisture resistance and efficient packaging without sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If fluoride phosphor is used to enhance brightness and color rendering, then luminous efficacy and color rendering index improve, but moisture sensitivity increases
Solution Approach 1:
The patent introduces an encapsulant as an intermediary substance that encapsulates the fluoride phosphor particles. This encapsulant layer acts as a barrier between the moisture-sensitive fluoride phosphor and the external environment, preventing moisture ingress while allowing the phosphor to maintain its luminescent properties. The encapsulant thus mediates between the need for high-performance fluoride phosphor and the need for moisture resistance.
Solution Approach 2:
The patent creates a composite material system consisting of encapsulated fluoride phosphor particles embedded in a silicone-based encapsulant matrix. This composite structure combines the high luminescent efficacy of fluoride phosphor with the moisture-resistant properties of the encapsulant material, achieving both brightness enhancement and moisture protection simultaneously.
2Object-affected harmful factors
If sintering process is used to create microcrystalline glass, then moisture resistance is achieved, but production complexity and time increase
Solution Approach 1:
The patent fundamentally changes the processing parameters from high-temperature sintering (requiring specialized equipment and long cycles) to low-temperature curing of silicone-based encapsulant. This parameter change enables the moisture resistance function to be achieved through a simpler, faster process that can be performed in standard semiconductor packaging facilities without requiring access to specialized sintering equipment.
Solution Approach 2:
The patent replaces the mechanical/thermal sintering process with a chemical curing process. Instead of using high-temperature thermal fields to sinter glass particles, the invention uses chemical crosslinking of silicone-based encapsulant at much lower temperatures to achieve the same moisture protection effect, thereby eliminating the need for complex sintering equipment and reducing production time.
3Object-affected harmful factors
If sintering process is used, then moisture resistance is achieved, but equipment investment and process complexity increase
Solution Approach 1:
The patent replaces the mechanical/thermal sintering process with a chemical curing process. Instead of using high-temperature thermal fields to sinter glass particles, the invention uses chemical crosslinking of silicone-based encapsulant at much lower temperatures to achieve the same moisture protection effect, thereby eliminating the need for complex sintering equipment and reducing production time.
4Object-affected harmful factors
If microcrystalline glass is produced externally, then moisture resistance is achieved, but communication overhead and production time increase
Solution Approach 1:
The patent merges the moisture protection function with the semiconductor packaging process itself. Instead of producing microcrystalline glass encapsulants at a separate glass sintering plant and then shipping them to semiconductor packaging facilities, the invention enables semiconductor packaging companies to directly apply and cure the encapsulant material in their own facilities, combining multiple steps into one integrated process and eliminating communication overhead and shipping time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively addresses the moisture sensitivity of fluoride phosphor, reduces production costs by 80-90%, and shortens the production cycle from 45 days to 3 days, enabling independent completion of packaging processes in semiconductor companies.
Implementation Method 1
the silicone-based encapsulant material...effectively addresses the moisture sensitivity of fluoride phosphor
Implementation Method 2
coated and cured at lower temperatures, achieving moisture resistance and efficient packaging without sintering
Data Source
AI summary
A preparation method of a non-sintered stacked device includes: mixing a first silicone, a first inhibitor, and a first fluoride phosphor to obtain a base layer mixed material; mixing a second silicone, a second inhibitor, and a phosphor to obtain a stacked layer mixed material; coating at least one unit green body in a stacked manner on a surface of a carrier substrate to obtain a formed green body; and curing the formed green body to obtain the non-sintered stacked device; and the curing temperature is a range of 150° C. to 250° C. The preparation method using a non-sintering method has less equipment, simple process and short cycle, and effectively solves the problem of fluoride being sensitive to moisture, the shrinkage and non-forming characteristics of the encapsulant during sintering, achieving the effect of mutual excitation of each layer structure and protection of luminescence of the phosphor.