Non-Spherical Solder Ball Molding for Uniform Mass Production
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Solution Overview
Problem
Conventional spherical solder balls have limitations when applied to semiconductor packaging or electronic component assembly with great height and narrow width, as they are difficult to manufacture into non-spherical shapes like hemispherical or hexahedral forms due to issues with viscosity, temperature, and mold shape, leading to inefficient and non-uniform production.
Innovation Solution
A method involving the use of a mold with non-spherical accommodation grooves to deform spherical solder balls into desired shapes by applying heat, pressure, or a combination of both, allowing for the mass production of non-spherical solder balls with uniform size and shape, including hemispherical, cylindrical, or hexahedral forms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional spherical solder ball making methods are used, then spherical solder balls with constant size can be efficiently mass-produced, but they cannot meet the requirements of semiconductor packaging with great height and narrow width
Solution Approach 1:
The patent changes the shape parameter of solder balls from spherical to non-spherical (hemispherical, hexahedral, cylindrical) by modifying the mold cavity design. This allows the solder balls to fit semiconductor packaging with great height and narrow width while maintaining mass production efficiency through standardized mold-based manufacturing processes
Solution Approach 2:
The patent segments the mold into multiple cavities with different shapes (hemispherical, hexahedral, cylindrical) to produce various non-spherical solder ball types in one manufacturing cycle. This segmentation enables diverse shape production while maintaining high productivity through parallel manufacturing
2Shape
If solder alloy sheet cutting method is used to make hexahedral solder balls, then non-spherical shapes can be achieved, but the process has low productivity and generates burrs
Solution Approach 1:
The patent replaces the mechanical cutting process (dicing saw or press mold) with a mold-casting process where molten solder alloy is directly formed into hexahedral shapes. This substitution eliminates burr generation from cutting operations and dramatically improves productivity by forming multiple pieces simultaneously in a single casting cycle
Solution Approach 2:
The patent utilizes the phase transition of solder alloy from solid to liquid and back to solid. The solder is melted, injected into hexahedral mold cavities, and then cooled to form precise hexahedral shapes without cutting, eliminating burrs and improving production efficiency
3Manufacturing precision
If mold method is used to manufacture non-spherical solder balls, then uniform shapes and sizes can be achieved, but the process is complex and difficult to control
Solution Approach 1:
The patent controls the viscosity and temperature parameters of molten solder alloy to achieve uniform filling of mold cavities. By optimizing these parameters, the complex mold process becomes controllable and produces consistent non-spherical shapes with high precision
Solution Approach 2:
The mold design incorporates self-leveling features where the molten solder automatically fills cavities to uniform levels based on gravity and surface tension, reducing the need for complex control mechanisms and simplifying the overall process while maintaining precision
4Quantity of substance
If precision dispenser is used to press and discharge solder alloy, then predetermined amounts can be delivered, but production quality is not constant
Solution Approach 1:
The patent uses the phase transition from liquid to solid during cooling in the mold cavity to ensure consistent solder ball formation. The controlled cooling process guarantees uniform solidification and shape, achieving constant production quality that cannot be obtained through dispensing methods alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, uniform, and economical mass production of non-spherical solder balls that can mechanically and electrically connect objects, overcoming the limitations of conventional spherical solder balls by ensuring consistent size and shape within acceptable deviations during mass production.
Implementation Method 1
a spherical solder ball is inserted into an accommodation groove and then softened by heating
Implementation Method 2
The spherical solder ball softened by the heating is deformed by ultrasonic waves, vibration of a motor
Implementation Method 3
the spherical solder ball is melted by the heating, and a shape of the accommodation groove is formed
Implementation Method 4
the molten solder is cooled, and then the non-spherical solder ball is withdrawn from the accommodation groove
Data Source
AI summary
Disclosed is a making method for mass-producing non-spherical solder balls. The making method includes: inserting spherical solder balls into non-spherical accommodation grooves; melting the spherical solder balls by heating and filling the accommodation grooves with the molten solder; making non-spherical solder balls by cooling the molten solder; and withdrawing the non-spherical solder balls from the accommodation grooves.