Non-vacuum Spinner Wafer Chuck with Cam Positioning

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Solution Overview

Problem

Conventional vacuum chucks for wafer processing machines face issues such as vacuum leaks, contamination, and damage to delicate wafers due to central contact, which can lead to process failures and scratches.

Innovation Solution

A non-vacuum, non-contact spinner wafer chuck design that uses wafer engagement and index cams to maintain wafer orientation and positioning without central contact, allowing for self-centering and accommodating various wafer diameters, preventing scratches and contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional vacuum chucks are used to hold wafers, then wafers can be securely positioned, but vacuum leaks and contamination occur causing process failures

Engineering Contradiction:

Improveprocess reliabilityVSAvoidvacuum leaks and contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes the vacuum system entirely from the wafer holding mechanism. Instead of using vacuum pressure to secure wafers, the invention employs a mechanical cam-based positioning system that physically engages with the wafer edges to maintain positioning without creating vacuum seals, thereby eliminating vacuum leaks and contamination risks

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the vacuum-based holding system with a mechanical cam and follower system. The cams physically engage with the wafer edges through controlled contact points, providing secure positioning through mechanical force rather than vacuum pressure, thus avoiding the harmful effects of vacuum systems

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If central contact is used to hold wafers, then wafers can be securely positioned, but scratches and damage occur on delicate wafers

Engineering Contradiction:

Improvewafer positioning stabilityVSAvoidwafer scratches and damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the wafer contact interface into multiple discrete cam structures rather than using a single central contact point. Each cam engages with a specific portion of the wafer edge, distributing the holding force across multiple points and avoiding concentrated stress that causes scratches and damage

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces cams as intermediary elements between the chuck mechanism and the wafer. These cams serve as mediators that provide controlled, distributed contact with the wafer edges, enabling secure positioning while minimizing direct mechanical stress on the wafer surface

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If vacuum chucks are used for wafer processing, then wafers can be held during processing, but vacuum-induced damage occurs

Engineering Contradiction:

Improvewafer processing capabilityVSAvoidvacuum-induced damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the vacuum system from the wafer processing workflow entirely. The cam-based positioning system enables wafer handling and processing without requiring vacuum environments, allowing wafers to be processed in atmospheric conditions while maintaining secure positioning through mechanical engagement

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the vacuum-based holding mechanism with a purely mechanical cam-follower system that provides wafer positioning and securing through physical engagement. This mechanical substitution eliminates the need for vacuum environments during processing, preventing vacuum-induced damage while maintaining processing capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11217474B2Non-vacuum, non-contact spinner wafer chuck

Publication Date: 2022.01.04 THE GOVERNMENT OF THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY DEPARTMENT OF HEALTH & HUMAN SERVICES

AI summary

A non-vacuum, non-contact spinner wafer chuck including: a basal member including; a fastener receiver that receives a fastener; a chuck collar including: an inner collar wall; and an outer collar wall; and an engagement surface that: receives and engages a wafer; a wafer engagement cam including: an engagement face that engages the wafer; an index cam disposed on the chuck collar and comprising: an index face that faces toward the fastener receiver and that engages the wafer; and a spinner engager disposed on the spinner-side surface of the basal member and comprising: a spinner arm receiver bounded by a wall and that receives a spinner of the wafer processing machine, wherein the wafer engagement cam and the index cam engage the wafer and maintains an orientation of the wafer with respect to the index cam in response to rotation of the wafer relative to the non-vacuum, non-contact spinner wafer chuck.