Notched Crystal Oscillation Chip for Secondary Wave Suppression
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Solution Overview
Problem
Modern crystal oscillation chips face issues with secondary waves such as bending and face shear vibrations at frequencies close to the main wave, leading to poor vibration characteristics, lower production yield, and hindering high-frequency miniaturization.
Innovation Solution
The introduction of notches on the side surfaces of the flat base plate of the crystal oscillation piece, connected by conductive silver adhesives, effectively suppresses secondary waves without affecting the main wave, allowing for larger manufacturing errors and improved production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip size design error range is reduced to avoid secondary waves, then vibration characteristics improve, but production yield decreases
Solution Approach 1:
The patent extracts the harmful secondary waves from the vibration system by introducing notches that selectively suppress bending vibration and face shear vibration modes. The notches act as energy dissipation structures that remove the problematic vibration components while preserving the main thickness shear vibration mode, thereby improving vibration characteristics without requiring extremely tight size tolerances.
Solution Approach 2:
The notches are strategically positioned at specific locations on the crystal oscillation piece to target particular vibration modes. By localizing the structural modification at these critical points, the patent achieves selective suppression of harmful vibrations without affecting the overall crystal structure or requiring uniform precision across the entire chip.
2Speed
If the chip is miniaturized for high frequency applications, then frequency performance improves, but secondary wave interference increases
Solution Approach 1:
The patent converts the harmful effect of miniaturization-induced secondary waves into a beneficial outcome by using the notches to suppress these very same secondary waves. The notches are designed to exploit the vibration characteristics of the miniaturized crystal to create destructive interference patterns that eliminate bending and face shear vibrations, turning the miniaturization problem into a solution.
Solution Approach 2:
The notches are designed to interact with the vibration modes of the crystal oscillation piece through mechanical vibration principles. The notch geometry and positioning are optimized to create phase shifts and energy dissipation that specifically target bending and face shear vibration modes, using vibration theory to suppress harmful oscillations while maintaining the desired high-frequency thickness shear vibration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The notched design enhances vibration characteristics, enabling higher production yield and efficient development of crystal oscillation chips by reducing secondary wave interference.
Implementation Method 1
two conductive silver adhesives connect the flat base plate and the casing
Implementation Method 2
the main wave (e.g., the thickness shear vibration mode) of the modern crystal oscillation chip
Data Source
AI summary
A crystal oscillation chip including a casing and a crystal oscillation piece is provided. The crystal oscillation piece is disposed in the casing. The crystal oscillation piece includes a flat substrate, two electrodes and two conductive silver glues, the two electrodes are respectively disposed on two opposite main surfaces of the flat substrate. The flat substrate includes at least one notch. The notch is disposed at a side surface of the flat substrate and is recessed along a direction vertical from the side surface and toward an interior of the flat substrate. A height of the notch is the same as a thickness of the flat substrate, and two conductive silver glues connect the flat substrate and the casing.