Semiconductor Device Notched Main Lead Placement
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Solution Overview
Problem
Conventional semiconductor devices face challenges in accurately positioning small semiconductor elements on leads due to size discrepancies, leading to potential displacement during assembly.
Innovation Solution
A semiconductor device design featuring a main lead with a recessed notch and auxiliary leads, where the semiconductor element is mounted on the main lead's surface, and auxiliary leads are exposed from the resin package for secure electrical connections, ensuring precise placement and enhanced joining strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor element is made smaller to achieve device miniaturization, then the device size is reduced, but the positioning accuracy of the semiconductor element on the lead deteriorates
Solution Approach 1:
A notch is formed in advance in the main lead at a predetermined position where the semiconductor element should be disposed. This preliminary structural feature guides the technician to place the small semiconductor element accurately on the lead, solving the positioning accuracy problem while maintaining miniaturization
Solution Approach 2:
The notch acts as an intermediary feature between the semiconductor element and the lead. It provides a physical reference point that facilitates accurate positioning of the small semiconductor element on the lead without requiring complex positioning mechanisms
2Volume of moving object
If the semiconductor element is made smaller, then the device is more compact, but the risk of displacement during assembly increases
Solution Approach 1:
The notch is prepared beforehand in the main lead to receive and secure the semiconductor element. This preliminary action prevents displacement during assembly by providing a designated placement zone that physically guides and stabilizes the small semiconductor element
Solution Approach 2:
The notch structure enables the semiconductor element to self-align and self-position on the lead during assembly. The technician simply needs to place the element near the notch, and the notch automatically guides it to the correct position, reducing assembly complexity and improving reliability
Data Source
AI summary
A semiconductor device is provided with a semiconductor element, a main lead on which the semiconductor element is disposed, and a resin package that covers the semiconductor element and the main lead. A notch that is recessed toward the center of the main lead in plan view as seen in the thickness direction of the semiconductor element is formed in the main lead.