Electronic Component Package With Notched Side Pads For Precise Mounting
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Solution Overview
Problem
The existing package for electronic components, particularly those with MEMS sensing elements, faces challenges in achieving a consistent angle when mounted on a substrate, leading to reduced sensing accuracy due to the difficulty in forming a flat end face, which results in an indefinite angle between the package and the mounting surface.
Innovation Solution
A package design with a flat cut surface and notched regions on the package body, where pads are formed on the inner walls of these notches, allowing for precise electrical bonding and solder filling to ensure perpendicular mounting and improved wettability, thereby maintaining a predetermined angle and enhancing sensing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the package body is formed by stacking and calcining plural ceramic plates, then the package structure is established, but the end face cannot be formed in a flat surface, resulting in indefinite mounting angle
Solution Approach 1:
The package body is divided into a main body portion and a separate flat surface portion (end face). The end face is formed as a distinct segment that can be independently planarized through lapping or grinding, while the main body retains its stacked ceramic plate structure. This segmentation allows the end face to achieve high flatness for precise mounting angles without compromising the manufacturing ease of the overall package body.
Solution Approach 2:
The end face is given a special local quality of high flatness through additional processing steps (lapping, grinding, or polishing) that are applied only to this specific surface. This localized treatment ensures that the mounting surface has the required precision for perpendicular mounting, while the rest of the package body maintains its original manufactured characteristics.
2Ease of operation
If the end face is abutted on the mounting surface without special considerations, then the mounting process is simple, but the angle between package body and mounting surface becomes indefinite, reducing sensing accuracy
Solution Approach 1:
The end face is pre-treated with a flat surface through lapping, grinding, or polishing before the mounting process. This preliminary action ensures that when the package is abutted on the mounting surface, the flat end face naturally contacts the mounting surface at a precise perpendicular angle, eliminating the need for complex alignment procedures during mounting while guaranteeing the required sensing accuracy.
3Reliability
If pads are formed on the flat cut surface, then electrical connection is achieved, but solder filling is uneven and package inclination occurs
Solution Approach 1:
Instead of forming pads on the flat cut surface (which would create symmetry and cause uneven solder distribution), the pads are formed on the inclined inner wall surfaces of notches. This asymmetric positioning of pads within the notched structure creates a geometric constraint that guides solder flow and prevents package inclination during the soldering process, while still ensuring reliable electrical connection between the pads and mounting substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable and accurate mounting of electronic components at a predetermined angle, improving the sensing accuracy and stability of the package by forming pads on inclined surfaces within the notches, which facilitates even solder filling and prevents package inclination.
Implementation Method 1
the inside of the notch part is filled with solder
Data Source
AI summary
A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.