Notched Microelectronic Substrates for Thin Stacked Die Packages

Solution Overview

Problem

The microelectronic industry faces challenges in producing thinner microelectronic structures while increasing integration density, as stacking components often results in unacceptable thickness.

Innovation Solution

A microelectronic substrate with notches is used to allow for the attachment and stacking of microelectronic dice, with bond wires extending through these notches for electrical communication, enabling thinner configurations without increasing thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If components are stacked to increase integration density, then integration density is improved, but thickness increases to unacceptable levels

Engineering Contradiction:

Improveintegration densityVSAvoidthickness

Core Design Contradiction:

Quantity of substanceVSLength of moving object

Solution Approach 1:

The substrate is segmented by introducing notches that divide it into distinct regions, allowing microelectronic dice to be stacked vertically while maintaining a thin overall profile. The notches create separate attachment zones that enable multi-layer integration without increasing lateral footprint, thus improving integration density while controlling thickness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from planar (2D) substrate utilization to three-dimensional (3D) stacking by attaching microelectronic dice vertically on substrate surfaces and extending bond wires through notches. This dimensional change allows multiple components to occupy the same lateral space at different heights, increasing integration density without proportionally increasing thickness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Length of moving object

If notches are added to the substrate to enable thin configurations, then thickness is reduced, but substrate complexity increases

Engineering Contradiction:

ImprovethicknessVSAvoidsubstrate complexity

Core Design Contradiction:

Length of moving objectVSDevice complexity

Solution Approach 1:

The substrate is segmented by introducing notches that divide it into distinct regions, allowing microelectronic dice to be stacked vertically while maintaining a thin overall profile. The notches create separate attachment zones that enable multi-layer integration without increasing lateral footprint, thus improving integration density while controlling thickness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate geometry is modified by changing its cross-sectional shape to include notches. This parameter change in the substrate structure enables vertical stacking and wire extension while maintaining a thin overall profile, reducing thickness without requiring complex external packaging or support structures.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11335640B2Microelectronic structures having notched microelectronic substrates

Publication Date: 2022.05.17 INTEL CORP

AI summary

A microelectronic package may be fabricated having at least one microelectronic die attached to a microelectronic substrate, wherein the microelectronic substrate includes at least one notch formed in at least one side thereof. The microelectronic dice may be attached to a first surface of the microelectronic substrate and in electronic communication with a bond pad on a second surface of the microelectronic substrate with a bond wire which extends through the notch in the microelectronic substrate.