Notebook Computer Fan Layout for Shorter Heat Dissipation Paths
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Solution Overview
Problem
Existing notebook computers suffer from low heat dissipation efficiency due to a long heat transfer path and high thermal resistance, leading to excessively high surface temperatures and reduced performance.
Innovation Solution
The notebook computer design incorporates a host housing with two first fans arranged parallel to a second wall plate and a second fan located between them, where the heat dissipation plate serves as a wall of the second fan's housing, allowing direct heat exchange with airflow, and additional features like heat dissipation fins and a heat pipe system to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a traditional heat dissipation path (heat generation device→heat dissipation plate→heat pipe→fin→air) is used, then heat can be transferred from the heat generation device, but the heat dissipation path is long and thermal resistance is high, resulting in low heat dissipation efficiency
Solution Approach 1:
The patent extracts and eliminates intermediate heat transfer components (heat pipe, fin) from the traditional heat dissipation path. The heat dissipation plate is directly exposed to the airflow generated by the fan, creating a direct heat exchange interface between the heat generation device and the moving air, thereby shortening the heat transfer path and reducing thermal resistance.
Solution Approach 2:
The host housing is divided into multiple air outlet structures, and fans are segmented and distributed at different positions. This segmentation allows multiple independent heat dissipation channels to operate simultaneously, increasing the overall heat dissipation efficiency and reducing the thermal load on any single path.
2Loss of energy
If multiple heat dissipation components are added to improve heat dissipation efficiency, then heat dissipation performance improves, but the thickness of the host increases
Solution Approach 1:
The heat dissipation plate is merged with the air outlet structure of the host housing, forming an integrated component. The fan is positioned to directly blow air onto the heat dissipation plate, combining the heat dissipation function with the housing structure. This eliminates the need for separate heat dissipation components that would increase thickness.
Solution Approach 2:
Instead of increasing heat dissipation capacity by adding components in the thickness direction, the patent utilizes the surface area of the heat dissipation plate and distributes multiple air outlet structures across different faces of the host housing. This three-dimensional distribution of air outlets allows efficient heat dissipation without increasing the overall thickness of the device.
3Loss of energy
If heat dissipation efficiency is improved by adding more heat dissipation components, then heat dissipation performance improves, but the device structure becomes more complex
Solution Approach 1:
The heat dissipation plate serves multiple functions: it acts as both a heat transfer component and a structural element of the host housing (forming part of the air outlet structure). The fan simultaneously generates airflow for cooling and creates a convection current that enhances heat transfer from the heat generation device to the heat dissipation plate, reducing the need for separate cooling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation efficiency, reduces surface temperatures, and facilitates a thinner laptop form factor while enhancing user experience by minimizing noise and improving performance.
Implementation Method 1
the heat dissipation plate is thermally conductive with the at least one heat generation device
Implementation Method 2
the second fan has an air outlet, and the air outlet of the second fan communicates with the first air outlet structure
Implementation Method 3
transfers heat of a heat generation device on a circuit board to a fin by using a heat dissipation plate and a heat pipe
Data Source
AI summary
This application provides a notebook computer. Specifically, the notebook computer includes a host, and the host includes a host housing, two first fans, and a second fan. The host housing includes a first wall plate and a second wall plate that are opposite to each other and that are spaced apart, and a third wall plate connected between the first wall plate and the second wall plate. A first air outlet structure is disposed on the second wall plate and/or the third wall plate. The two first fans are arranged at intervals, and an arrangement direction of the two first fans is parallel to the second wall plate. The second fan is disposed in the host housing, and is located between the foregoing two first fans. The second fan has an air outlet, and the air outlet of the second fan communicates with the first air outlet structure.