Notebook Heat Dissipation Unit with Stacked Fixing Stations
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Solution Overview
Problem
Conventional heat dissipation units in notebooks are inefficient due to the side-by-side arrangement of display cards, which increases the width of the device, length of heat pipes, and heat resistance, hindering effective heat dissipation and complicating circuit design with long wires.
Innovation Solution
The heat dissipation unit features a first and second fixing station on separate planes with a gap between them, allowing the first and second circuit elements to overlap, reducing the width of the device, and connecting heat pipes to a heat sink to decrease heat resistance and improve dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If display cards are arranged side by side, then the notebook width increases, but the heat dissipation efficiency deteriorates due to longer heat pipes and higher heat resistance
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side arrangement to a three-dimensional stacked arrangement where display cards are positioned on different planes (first plane and second plane) with vertical separation. This dimensional change allows heat pipes to connect more directly to the heat sink, reducing their length and heat resistance while maintaining a compact notebook width.
2Device complexity
If display cards are arranged side by side, then the notebook width increases, but the circuit design becomes more complex due to longer wires
Solution Approach 1:
By stacking display cards on different planes vertically rather than arranging them horizontally, the patent reduces the horizontal distance that wires must traverse to connect to the controller. This dimensional reorganization simplifies circuit design while keeping the notebook compact.
3Productivity
If heat pipe length is reduced, then heat resistance decreases and heat dissipation efficiency improves, but the notebook width must be reduced
Solution Approach 1:
The patent achieves shorter heat pipes by moving from horizontal to vertical arrangement, utilizing the third dimension (height/depth) to reduce the distance between heat sources and heat sink. This allows improved heat dissipation efficiency without increasing notebook width.
4Ease of operation
If display cards are positioned far from heat sink, then heat pipe length increases, but heat resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
By positioning display cards on different planes with vertical separation from the heat sink, the patent creates more direct and shorter heat pipe pathways. This three-dimensional arrangement reduces heat pipe length and heat resistance, improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the width of the notebook, shortens heat pipe lengths, decreases heat resistance, and enhances heat dissipation efficiency while simplifying circuit design by reducing wire lengths.
Implementation Method 1
The heat pipe 21 is connected to the fixing station 20 to move the heat generated by the display card 22 to the heat sink 10. Similarly, the heat pipe 31 is connected to the fixing station 30 to move the heat generated by the display card 32 to the heat sink 10.
Implementation Method 2
the heat pipe 21 is connected to the fixing station 20 to move the heat generated by the display card 22 to the heat sink 10
Implementation Method 3
The heat dissipation unit comprises a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe
Data Source
AI summary
A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station.