Notebook Key Structure With Heat-Conducting Scissor Assembly
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Solution Overview
Problem
Current notebook computer keyboard structures, primarily using membrane keyboards, hinder heat dissipation and result in localized hot spots due to the interference of the membrane with heat transfer, leading to adverse tactile experiences for users.
Innovation Solution
A key structure incorporating a base, platform, scissor mechanism, heat conducting member, and elastic member, where the heat conducting member is clamped between the key cap and platform, allowing for efficient heat transfer and dissipation through the elastic member, enhancing thermal conductivity and aesthetics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a membrane keyboard structure is used, then the keyboard provides a complete sealing structure, but the membrane interferes with heat transfer and causes localized hot spots
Solution Approach 1:
The keyboard structure is segmented into multiple independent key units, each with its own heat dissipation path through the scissor mechanism and base. This allows heat to be dissipated locally at each key position rather than being blocked by a continuous membrane, resolving the contradiction between sealing completeness and heat dissipation efficiency.
Solution Approach 2:
The scissor mechanism and base structure serve as intermediary heat transfer paths between the key cap and the heat dissipation system. These components conduct heat away from the key contact region, acting as thermal mediators that enable both membrane sealing and effective heat dissipation to coexist.
2Device complexity
If rubber dome is used for elastic restoration, then the keyboard provides simple structure and cost-effective solution, but heat concentrates in the contact region between rubber dome and key cap
Solution Approach 1:
The scissor mechanism combines multiple functions into a single structural assembly: it provides elastic restoration like a rubber dome, enables heat dissipation through its metal components, and maintains the key cap at the correct height. This merging eliminates the heat concentration problem while preserving structural simplicity.
Solution Approach 2:
The scissor mechanism utilizes composite construction with metal components for heat conduction and plastic components for structural support and elasticity. This composite approach enables simultaneous achievement of thermal management and mechanical functionality without increasing overall structural complexity.
3Device complexity
If heat dissipation paths are concentrated on the side and bottom of the body, then the design maintains simple heat dissipation structure, but the keyboard region lacks heat dissipation means and causes hot spots
Solution Approach 1:
The heat dissipation approach transitions from concentrating heat paths in specific locations (side and bottom) to distributing heat dissipation across the keyboard surface area. Each key becomes a heat dissipation node, utilizing the vertical dimension through the scissor mechanism and base to conduct heat to the keyboard surface for radiation and convection.
Solution Approach 2:
The scissor mechanism and base structure serve multiple functions simultaneously: providing mechanical support for key actuation, enabling elastic restoration, conducting heat away from contact regions, and facilitating heat dissipation across the keyboard surface. This multi-functionality eliminates the need for separate heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The key structure effectively dissipates heat, reducing hot spots and improving tactile perception by homogenizing heat transfer and providing additional dissipation paths, while maintaining an aesthetic appearance.
Implementation Method 1
the heat at the base can be smoothly transferred to the heat conducting member through the elastic member
Implementation Method 2
with the heat conducting member being in contact with the elastic member, heat is homogenized and then dissipated into the space where the key structure is located
Data Source
AI summary
A key structure including a base, a platform, a scissor structure, a heat conducting member, an elastic member, and a key cap is provided. The scissor structure is movably pivoted between the platform and the base. The heat conducting member is disposed on the platform. The elastic member is disposed on the base and is structurally in contact with the heat conducting member by passing through an opening of the platform. The key cap is disposed on the platform, and the heat conducting member is clamped between the key cap and the platform.