Notebook Metal Hinge as Heat Sink for Thermal Management

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Solution Overview

Problem

As computing devices become thinner and more compact, effectively cooling central processing units and other components while maintaining acceptable surface temperatures becomes challenging, necessitating new heat dissipation techniques.

Innovation Solution

A notebook metal hinge is used as a heat sink element, where a metal hinge couples the base and display portions, incorporating a heat exhaust element, such as a fan, to transfer heat away from heat-generating components to the hinge, which then radiates it into the environment through a series of metal fins and airflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If computing devices are made thinner and more compact, then device portability and design appeal are improved, but heat dissipation capability deteriorates

Engineering Contradiction:

Improvedevice thicknessVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The hinge assembly is designed to perform multiple functions: it provides mechanical coupling between base and display portions, serves as a heat sink to absorb and dissipate heat from the processor, and acts as a structural support element. This multi-functionality allows the device to maintain thin profile while incorporating effective heat dissipation without adding separate dedicated cooling components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The metal hinge structure serves itself as a heat sink by utilizing its inherent thermal conductivity and surface area. The hinge naturally absorbs heat from adjacent processor components through thermal conduction and dissipates it to the ambient environment through its exposed surfaces, eliminating the need for separate active cooling mechanisms in the thin device design.

Inventive Principle:

Principle #25Self-service

2Temperature

If traditional heat sink components are added, then heat dissipation capability is improved, but device complexity and space requirements worsen

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidcomponent count

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation function is merged with the existing hinge assembly structure. The metal hinge serves dual purposes as both a mechanical connector and a thermal management component, combining what would traditionally be separate elements (hinge mechanism and heat sink) into a single integrated component, thereby reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If heat is exhausted directly from heat generating elements, then cooling efficiency is improved, but surface temperature of enclosures worsens

Engineering Contradiction:

Improvecomponent cooling efficiencyVSAvoidsurface temperature

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The metal hinge acts as an intermediary thermal management component between the heat-generating processor and the ambient environment. It absorbs heat from the processor through thermal conduction and dissipates it to the surrounding air through convection and radiation from its exposed surfaces, serving as a buffer that prevents direct heat transfer to the device enclosures and maintains acceptable surface temperatures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat generated by components within the computing device, maintaining optimal operating temperatures while maintaining a sleek and appealing design by utilizing the metal hinge to increase the surface area for heat radiation.

Implementation Method 1

a heat exhaust element disposed within the base portion and operable to transfer heat away from the heat generating element

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

The hinge portion is disposed relative to the heat exhaust element such that at least some of the exhausted heat is exhausted away from the heat generating element to the hinge portion and heats the hinge portion

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

which then radiates it into the environment through a series of metal fins and airflow

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP2786222B1Notebook metal hinge as heat sink element

Publication Date: 2019.07.03 GOOGLE LLC

Figure 1A~1B
Figure 2
Figure 3

AI summary

A computing device can include a base portion housing a central processing unit, a heat exhaust element disposed within the base portion and operable to move air past the central processing unit, a display portion configured to display information to a user, and a metal hinge portion operably coupling the base portion to the display portion and being operable to couple the base portion to the display portion between an open and a closed configuration. The hinge portion can include a hollow cavity extending parallel to a longitudinal axis of the metal hinge and a longitudinal slot in a wall of the metal hinge and parallel to the longitudinal axis, where the longitudinal slot is positioned relative to the heat exhaust element so as to receive air moved by the heat exhaust element through the slot and into the hollow cavity.