Novel Epoxy Curing Catalyst with Multi-Residue Structure

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Solution Overview

Problem

Conventional curable compositions containing epoxy compounds require improved curability, particularly in terms of heat resistance, which is not adequately addressed by existing epoxy curing agents.

Innovation Solution

A novel compound with multiple residues exhibiting epoxy curability under different conditions is developed, serving as an effective epoxy curing catalyst, and a method for producing this compound is established, allowing for gradual epoxy curability during heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional curing agents are used, then the curable composition can be formulated, but the heat resistance and curability of the epoxy cured product are insufficient

Engineering Contradiction:
Improveheat resistance of epoxy cured productVSAvoidcurability of curable composition
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple residues exhibiting epoxy curability (imidazole residue, triazole residue, tetrazole residue) within a single compound structure. This merging of multiple curable residues enables the compound to provide both good curability at lower temperatures and enhanced heat resistance at higher temperatures, resolving the contradiction between ease of manufacture and reliability of the epoxy cured product.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The compound of formula (1) acts as a composite curing catalyst containing multiple functional residues that operate under different conditions. The imidazole residue provides initial curing activity, while the triazole and tetrazole residues contribute to heat resistance and gradual curability during heating. This composite structure enables simultaneous achievement of good curability and heat resistance.

Inventive Principle:
Principle #40Composite materials

2Reliability

If a single curing catalyst is used, then the formulation is simple, but the curability and heat resistance cannot be simultaneously optimized

Engineering Contradiction:
ImprovecurabilityVSAvoidcompound structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The compound of formula (1) serves multiple functions within a single molecular structure: the imidazole residue provides catalytic activity for good curability, while the triazole and tetrazole residues enhance heat resistance and provide gradual curability during heating. This multi-functionality allows a single compound to optimize both curability and heat resistance without requiring multiple separate additives.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The compound is segmented into multiple functional residues (imidazole, triazole, tetrazole) that can be independently optimized for different functions. Each residue type contributes specific properties: imidazole for curability, and triazole/tetrazole for heat resistance. This segmentation within a unified molecular structure enables simultaneous optimization of multiple performance parameters.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11718587B2Compound, epoxy curing catalyst and method for producing compound
Publication Date: 2023.08.08 TOKYO OHKA KOGYO CO LTD
  • US11718587B2 patent drawing
  • US11718587B2 patent drawing
  • US11718587B2 patent drawing

AI summary

A novel compound suitable as an epoxy curing catalyst; an epoxy curing catalyst using the compound; and a method for producing the compound. A compound represented by formula (1) in which Xm+ represents an m valent counter cation, R1 represents an aromatic group which may have a substituent; R2 represents an alkylene group which may have a substituent; R3 represents a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfonic acid ester group, a phosphino group, a phosphinyl group, a phosphonic acid ester group or an organic group; m represents an integer of 1 or more; n represents an integer of 0-3; and R2 may bond with R1 to form a cyclic structure.