Novolac Epoxy Resin for Halogen-Free Semiconductor Encapsulation
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Solution Overview
Problem
Conventional epoxy resin compositions for encapsulating semiconductor devices rely on halogen flame retardants, which generate toxic byproducts when combusted, and alternative non-halogen flame retardants may compromise curing performance or reliability.
Innovation Solution
An epoxy resin composition comprising an aromatic hydrocarbon modified novolac epoxy resin, a curing agent, and an inorganic filler, with specific weight percentages and structures, providing excellent flame retardancy without halogen-based flame retardants through the formation of a char layer at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If halogen flame retardants are used to achieve flame retardancy, then flame retardancy is improved, but toxic byproducts are generated when combusted
Solution Approach 1:
The patent converts the harmful effect of halogen flame retardants by replacing them with non-halogen alternatives that achieve similar flame retardancy without generating toxic byproducts. The aromatic hydrocarbon modified novolac epoxy resin serves as a beneficial alternative that provides flame protection while being environmentally friendly and non-toxic when combusted.
Solution Approach 2:
The patent changes the chemical composition parameters of the flame retardant system by switching from halogen-based compounds to non-halogen-based aromatic hydrocarbon modified novolac epoxy resin. This parameter change maintains the flame retardancy function while eliminating the harmful toxic byproduct generation characteristic of halogen flame retardants.
2Object-generated harmful factors
If non-halogen flame retardants are used to avoid toxic byproducts, then environmental friendliness is improved, but curing performance or reliability may be compromised
Solution Approach 1:
The patent employs a composite material approach by combining aromatic hydrocarbon modified novolac epoxy resin with specific curing agents and inorganic fillers. This composite formulation ensures that the non-halogen flame retardant system maintains adequate curing performance and reliability through the synergistic interaction of multiple components, overcoming the potential deficiencies of non-halogen alternatives.
Solution Approach 2:
The patent optimizes the chemical parameters of the epoxy resin composition by adjusting the molecular structure of the aromatic hydrocarbon modified novolac epoxy resin and selecting appropriate curing agents. This parameter optimization ensures that the non-halogen flame retardant system achieves both environmental friendliness and adequate curing performance.
3Ease of manufacture
If conventional epoxy resin compositions are used to maintain simplicity, then ease of manufacture is improved, but flame retardancy may be compromised
Solution Approach 1:
The patent modifies the chemical parameters of conventional epoxy resin compositions by introducing aromatic hydrocarbon modified novolac epoxy resin with specific molecular structures. This parameter change enhances flame retardancy while maintaining the simplicity and ease of manufacture of the composition, as the modified resin integrates flame retardant functionality directly into the base material.
Solution Approach 2:
The patent achieves multi-functionality by using aromatic hydrocarbon modified novolac epoxy resin that simultaneously provides adhesion, moisture resistance, and flame retardancy. This universal resin component eliminates the need for separate flame retardant additives, maintaining manufacturing simplicity while enhancing flame protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves V-0 flame retardancy, improved adhesion, reliability, and fluidity, while being environmentally friendly by avoiding toxic byproducts and maintaining moldability and curing performance.
Implementation Method 1
The composition achieves V-0 flame retardancy, good adhesion, and reliability while avoiding the use of toxic halogen flame retardants
Implementation Method 2
an inorganic filler, specifically using a mixture of spherical fused silica
Implementation Method 3
a curing agent, a curing accelerator, an inorganic filler, and an epoxy resin
Implementation Method 4
providing excellent adhesion, moisture resistance, and reliability
Data Source
AI summary
An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1:wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.