Novolac Phenol Resin for High Sensitivity Photoresist
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Solution Overview
Problem
Existing positive photoresist compositions lack sufficient sensitivity and heat resistance, particularly for forming finer patterns in semiconductor manufacturing and display devices, where high sensitivity and heat resistance are required.
Innovation Solution
A novolac phenol resin with a specific repeating structural unit is used as a sensitivity enhancer, obtained by polycondensation of an alkyl-substituted phenol and an aromatic aldehyde, followed by condensation with an aldehyde-based compound, to create a positive photoresist composition that achieves high sensitivity and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional positive photoresist compositions using alkali-soluble resins and sensitizers are used, then developing properties such as sensitivity are improved, but heat resistance is insufficient
Solution Approach 1:
The invention uses a composite resin system combining novolac resin (providing heat resistance) with polyhydroxyl compound and sensitizers (providing sensitivity). This composite approach allows the photoresist to achieve both high sensitivity for fine pattern formation and sufficient heat resistance for withstanding manufacturing processes, resolving the contradiction between these two properties.
Solution Approach 2:
The invention modifies the chemical composition parameters of the resin system by incorporating specific ratios of novolac resin, polyhydroxyl compounds, and sensitizers. By adjusting these compositional parameters, the photoresist achieves optimized balance between sensitivity and heat resistance, enabling it to meet the requirements for finer line formation while maintaining thermal stability.
2Manufacturing precision
If sensitivity enhancers such as 2,3,4-trihydroxybenzophenone are used to improve sensitivity, then developing properties are enhanced, but heat resistance deteriorates
Solution Approach 1:
The invention carefully controls the type and amount of polyhydroxyl compound used as sensitivity enhancer, selecting compounds with appropriate molecular structures and optimizing their concentration in the composition. This parameter optimization allows achieving high sensitivity while minimizing the negative impact on heat resistance, unlike conventional approaches that use excessive or inappropriate sensitivity enhancers.
Solution Approach 2:
The invention creates a balanced composite system where novolac resin provides the heat-resistant backbone while polyhydroxyl compounds and sensitizers are incorporated in optimized amounts to enhance sensitivity without compromising thermal stability. This composite approach resolves the contradiction by distributing functions across different components with appropriate proportions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a coating film with enhanced sensitivity and heat resistance, suitable for forming finer patterns in semiconductor and display device manufacturing, with improved alkali solubility and thermal stability.
Implementation Method 1
a novolac phenol resin (B) having a repeating structural unit represented by formula (1), obtained by allowing a phenolic hydroxyl group-containing aromatic compound and an aldehyde compound to react to obtain a condensate, and then allowing the condensate to further react with an aldehyde-based compound
Implementation Method 2
Positive photoresists that use alkali-soluble resins and sensitizers such as 1,2-naphthoquinone diazide compounds have been known to serve as resists for manufacturing semiconductors
Implementation Method 3
coating films made from positive photoresist compositions need to withstand heat since they are subjected to various heat treatments in the steps of manufacturing semiconductors
Implementation Method 4
Positive photoresists that use alkali-soluble resins and sensitizers such as 1,2-naphthoquinone diazide compounds
Data Source
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AI summary
An object of the present invention is to provide a positive photoresist composition having excellent developing properties and heat resistance and a coating film made from the composition. A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A). The novolac phenol resin (B) has a repeating structural unit represented by formula (1) [In the formula, R represents a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms and X represents a structure (x1) represented by formula (2) (In the formula, R1, R2, and R3 each independently represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms; m and n each independently represent an integer of 1 to 4; p represents an integer of 0 to 4; and t represents 1 or 2) or an aromatic hydrocarbon group (x2) other than the structure (x1)]. The content of the structure (x1) relative to the total number of the structure (x1) and the structure (x2) is 85% or more.