Novolak Resin Cleaning Composition for Semiconductor Particle Removal
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Solution Overview
Problem
Current semiconductor substrate cleaning methods face challenges in efficiently removing fine particles from patterned surfaces due to difficulties in liquid and gas flow, especially with increasing miniaturization and aspect ratios, and are complex in terms of film removal and potential residual issues.
Innovation Solution
A composition comprising novolak resin, a non-polymeric organic acid, and a solvent with a solid content concentration of no greater than 20% by mass, which forms a film on the substrate to facilitate the efficient removal of particles and easily removable from the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If liquid and gas are used for cleaning semiconductor substrates, then the cleaning process can remove particles from substrate surfaces, but the liquid and gas cannot effectively flow between pattern walls in miniaturized structures with high aspect ratios, making removal of fine particles difficult
Solution Approach 1:
The patent replaces mechanical cleaning methods (liquid/gas flow) with a chemical film-based cleaning mechanism. A coating liquid is applied to form a film that adheres to particles, and the film is then removed mechanically with adhesive tape, eliminating the need for liquid/gas flow into narrow pattern spaces.
Solution Approach 2:
The patent introduces a coating liquid as an intermediary substance that mediates between the cleaning system and the particles. The coating liquid forms a film that acts as a carrier to transport particles out of the patterned structures, solving the problem of particle removal from high aspect ratio features.
2Manufacturing precision
If a coating liquid is applied to form a thin film for particle removal, then fine particles can be removed at high rates, but the process becomes complex and may leave residual film in patterns
Solution Approach 1:
The patent optimizes parameters of the coating liquid including solid content concentration (1-20 mass%), viscosity (10-1000 cP), and specific chemical composition (novolak resin with molecular weight 1000-100000). These parameter changes enable the film to be easily removable while maintaining high particle removal efficiency.
Solution Approach 2:
Instead of trying to remove particles directly from the substrate, the patent inverts the approach by first forming a film that captures particles, then removing the entire film-particle complex together. This inversion simplifies the cleaning mechanism and reduces process complexity.
3Manufacturing precision
If the solid content concentration of the coating liquid is increased to improve film formation, then particle removal effectiveness may improve, but the film becomes harder to remove and may cause pattern collapse
Solution Approach 1:
The patent identifies and optimizes the solid content concentration parameter to a specific range (1-20 mass%). Within this range, the film has sufficient adhesion to particles for effective removal, yet maintains enough flexibility and ease of detachment to avoid pattern collapse and ensure complete removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively removes particles from semiconductor substrates, particularly from patterned surfaces, with improved film removability and reduced risk of pattern collapse, suitable for advanced miniaturization and high aspect ratio manufacturing processes.
Implementation Method 1
a treatment liquid for forming a film on a substrate surface is supplied and solidified or hardened
Implementation Method 2
the entire treatment liquid solidified or hardened is dissolved in a removing liquid to remove particles on the substrate surface
Data Source
AI summary
A composition for cleaning a semiconductor substrate contains: a novolak resin; an organic acid not being a polymeric compound; and a solvent. A solid content concentration of the composition is no greater than 20% by mass. The organic acid is preferably a carboxylic acid. The carboxylic acid is preferably a monocarboxylic acid, polycarboxylic acid or a combination thereof. The molecular weight of the organic acid is preferably from 50 to 500. The content of the organic acid with respect to 10 parts by mass of the novolak resin is preferably from 0.001 parts by mass to 10 parts by mass. The solvent includes preferably an ether solvent, an alcohol solvent, or a combination thereof. The proportion of the ether solvent, the alcohol solvent, or the combination thereof in the solvent is preferably no less than 50% by mass.