Novolak Resist Fine Pattern Formation via Flood Exposure
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Solution Overview
Problem
In the manufacturing of liquid crystal display devices, existing techniques face challenges in achieving high-resolution fine patterns due to limitations in exposure wavelength and numerical aperture, which affect pattern accuracy and yield, especially with large glass substrates having surface unevenness.
Innovation Solution
A method involving coating a novolak resin resist composition, followed by exposure, development, flood exposure, and application of a fine pattern forming composition, with subsequent heating and removal of uncured regions to form a fine pattern with a taper shape below the resolution limit, without altering the exposure apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If exposure wavelength is shortened or NA is increased to improve resolution, then pattern resolution is improved, but device complexity and cost increase due to expensive apparatus changes
Solution Approach 1:
The patent changes the chemical parameters of the resist composition (using novolak resin with specific alkali dissolution rate and specific photosensitive components) to achieve finer pattern formation without changing the exposure apparatus parameters (wavelength and NA remain constant). This resolves the contradiction by improving resolution through material parameter changes rather than apparatus parameter changes.
2Manufacturing precision
If NA is increased to improve resolution, then pattern resolution is improved, but depth of focus decreases making the pattern accuracy sensitive to substrate unevenness
Solution Approach 1:
The patent uses novolak resin with controlled alkali dissolution rate (100-3000 Å) to achieve pattern miniaturization through chemical dissolution control rather than optical parameter changes. This maintains a wide depth of focus while achieving high resolution, making the process tolerant to substrate unevenness and improving reliability.
3Ease of manufacture
If conventional resist techniques are used to form fine patterns, then manufacturing process is simple, but pattern size reduction is insufficient to achieve below resolution limit
Solution Approach 1:
The patent introduces a specific resist composition system using novolak resin as an intermediary material that enables pattern miniaturization below the optical resolution limit. The novolak resin acts as a mediator that, when combined with specific photosensitive components and treated with alkali solution, achieves fine pattern formation without requiring complex apparatus changes, thus maintaining ease of manufacture while improving precision.
4Manufacturing precision
If high resolution is pursued by changing exposure apparatus, then pattern resolution is improved, but throughput decreases due to process complexity
Solution Approach 1:
The patent changes the resist composition parameters (novolak resin type, photosensitive component composition, alkali dissolution rate) rather than exposure apparatus parameters. This approach achieves high resolution while maintaining the existing exposure process conditions, thereby preserving manufacturing throughput and avoiding productivity loss associated with apparatus changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces pattern size while maintaining a taper shape, achieving high size reduction and high yield with low exposure dose, suitable for large glass substrates and improving pattern accuracy.
Implementation Method 1
a step of subjecting the resist composition layer to exposure
Implementation Method 2
a step of heating the resist pattern and the fine pattern forming composition layer to cure the fine pattern forming composition layer in the vicinity of the resist pattern and to form an insolubilized layer
Data Source
AI summary
A method of manufacturing a fine pattern using the following steps of:(1) coating a resist composition containing a novolak resin having an alkali dissolution rate of 100 to 3,000 Å on a substrate to form a resist composition layer;(2) subjecting said resist composition layer to exposure;(3) developing said resist composition layer to form a resist pattern;(4) subjecting said resist pattern to flood exposure;(5) coating a fine pattern forming composition on the surface of said resist pattern to form a fine pattern forming composition layer;(6) heating said resist pattern and said fine pattern forming composition layer to cure the regions of said fine pattern forming composition layer in the vicinity of said resist pattern and to form an insolubilized layer; and(7) removing uncured regions of said fine pattern forming composition layer.