Nozzle Arm Temperature Control for Semiconductor Substrate Processing
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in maintaining the temperature of treating liquids during standby, processing, and movement of nozzle arms, which can affect the consistency and efficiency of deposition, developing, etch, and cleaning processes.
Innovation Solution
A substrate processing apparatus with a nozzle arm that includes a treating liquid pipe and a temperature adjusting mechanism, such as a heating coil, thermoelectric elements, or a temperature adjusting liquid pipe, to maintain the temperature of the treating liquid during standby, processing, and movement between positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the nozzle arm is moved between standby position and processing position, then the treating liquid can be supplied to the substrate, but the temperature of the treating liquid may change affecting process consistency
Solution Approach 1:
The patent applies parameter changes by actively controlling the temperature of the treating liquid through heating or cooling mechanisms. The system adjusts temperature parameters during standby, movement, and processing phases to maintain consistency, preventing temperature drift that would affect manufacturing precision.
Solution Approach 2:
The patent ensures continuous temperature control of the treating liquid throughout all phases (standby, movement, processing). The temperature adjustment mechanism operates continuously rather than intermittently, maintaining stable treating liquid temperature at all times to ensure process consistency.
2Reliability
If temperature control mechanisms are added to the nozzle arm, then the treating liquid temperature can be maintained, but the device complexity increases
Solution Approach 1:
The patent integrates temperature control functionality into the existing nozzle arm structure, making the nozzle arm multi-functional. The same arm that moves and positions the treating liquid also incorporates heating/cooling capabilities, reducing the need for separate dedicated temperature control devices and minimizing overall system complexity.
Solution Approach 2:
The patent merges the temperature control mechanism with the nozzle arm structure. The heating coil, thermoelectric element, or temperature adjusting liquid pipe are integrated directly into the nozzle arm, combining multiple functions (liquid delivery and temperature control) into a single unified component rather than using separate independent systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures the treating liquid is maintained at a predetermined temperature throughout the process, enhancing the consistency and efficiency of semiconductor manufacturing processes by reducing conveying loads and preventing leaks.
Implementation Method 1
the arm supporting member may have a block shape with a lengthwise direction corresponding to the nozzle arm and surface-contacts a lower end of the nozzle arm along a length of the nozzle arm to transfer heat to the nozzle arm through heat conduction
Implementation Method 2
adjusting a temperature of the treating liquid in the treating liquid pipe built into the nozzle arm, through heat transfer with the nozzle arm
Data Source
AI summary
Provided are a treating liquid supplying unit, and a substrate processing apparatus and method using the same. Temperature of treating liquid in a treating liquid pipe built into a nozzle arm can be maintained, through heat transfer between the nozzle arm and a standby port and heat transfer between the nozzle arm and a nozzle moving unit, while the nozzle arm is standing by in standby position, while processing is being performed at a processing position, and during movement between the standby position and a processing position. Thus, treating liquid supplied from a nozzle can be maintained at a predetermined temperature by the treating liquid supplying unit, and the substrate processing apparatus and method using the same.