Nozzle Arrangement With Grooved Mount for Component Cooling
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Solution Overview
Problem
Existing cooling technologies, such as air cooling and liquid immersion, struggle to provide efficient and uniform cooling for electrical components, especially with the increased heat generation of modern components, leading to performance limitations and safety hazards.
Innovation Solution
A nozzle arrangement that directs liquid coolant directly onto electronic components, utilizing a mount with grooves for dispersion and snap-fit connections, coupled via push-fit nozzles, to optimize cooling for components of varying temperatures, including high, medium, and low heat outputs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling is used, then the cooling system is simple, but cooling efficiency and uniformity are insufficient for high-performance components
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant delivery system with nozzles that spray liquid coolant directly onto hot spots of electronic components. This hydraulic approach enables significantly higher heat removal efficiency compared to air cooling, addressing the productivity/cooling efficiency requirement while maintaining reasonable system complexity through targeted application.
Solution Approach 2:
The patent applies cooling selectively at specific locations rather than uniformly across all components. Nozzles are positioned to target specific hot spots on electronic components, delivering coolant only where heat generation is highest. This local quality approach optimizes cooling efficiency while reducing the overall complexity and coolant flow requirements compared to full-component cooling.
2Productivity
If liquid immersion cooling is used, then cooling efficiency improves, but coolant usage and cost increase
Solution Approach 1:
The patent extracts the essential cooling function from full liquid immersion and implements it through targeted liquid spray. Instead of submerging components in coolant, the system uses nozzles to deliver coolant only to specific hot spots on components. This extraction approach maintains high cooling efficiency while dramatically reducing the quantity of coolant required compared to complete immersion systems.
Solution Approach 2:
The patent applies cooling selectively at specific locations rather than uniformly across all components. Nozzles are positioned to target specific hot spots on electronic components, delivering coolant only where heat generation is highest. This local quality approach optimizes cooling efficiency while reducing the overall complexity and coolant flow requirements compared to full-component cooling.
3Productivity
If fixed cooling systems are used, then installation is complex, but cooling performance is optimized
Solution Approach 1:
The patent introduces movable and adjustable elements to the cooling system, including adjustable nozzle positions and flexible mounting mechanisms. This allows the cooling system to be adapted to different component configurations and installed more easily, while still achieving optimized cooling performance through proper positioning of nozzles at hot spots.
Solution Approach 2:
The patent designs a universal cooling system that can accommodate different electronic component types and configurations. The nozzle assembly and mounting system are designed to be adaptable rather than custom-built for each specific component, enabling the same cooling system to serve multiple functions and applications while maintaining optimized cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by targeting the hottest regions of components, reduces coolant usage and costs, simplifies installation and maintenance, and minimizes spillage and leakage risks, while improving overall system performance and economic efficiency.
Implementation Method 1
a nozzle for discharging liquid coolant
Implementation Method 2
direct cooling of an electronic component... liquid coolant is discharged from the nozzle through the mount and dispersed by the mount
Implementation Method 3
the mount configured to disperse the liquid coolant... the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount
Data Source
Figure 1
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AI summary
A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.