Nozzle-Shaped Bonding Layout for Stable Chip Mounting
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Solution Overview
Problem
Existing methods for bonding components, such as semiconductor chips, lack stability and consistency, leading to potential issues in device manufacturing.
Innovation Solution
A bonding method that applies a bonding material through a nozzle with a defined shape, allowing the material to extend beyond the component's bonding face, ensuring a stable bond by interposing additional material beyond the initial application area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the bonding material is applied only within the bonding face area, then the coating thickness can be reduced, but the bonding stability deteriorates
Solution Approach 1:
The bonding material is applied in advance beyond the bonding face boundaries, creating a surplus that will later flow out during pressing. This preliminary excess application ensures that sufficient material is available to fill gaps and create stable bonds, while the initial coating thickness remains controlled.
Solution Approach 2:
The bonding material is applied in excess beyond what is strictly needed within the bonding face area. This excessive action ensures that when the component is pressed onto the base, there is enough material to flow out and create reliable bonding, compensating for any material deficiency that might occur during the pressing process.
2Reliability
If the nozzle outline extends beyond the bonding face, then the bonding material coverage is improved, but the manufacturing precision deteriorates
Solution Approach 1:
Different regions of the bonding material application have different functions: the central region within the bonding face provides precise positioning, while the peripheral regions extending beyond the bonding face provide bonding stability. This local differentiation allows each region to optimize its specific function.
Solution Approach 2:
The bonding material application transitions from a two-dimensional precise outline control to a three-dimensional volume control. By allowing the material to extend beyond the bonding face in the plan view and then controlling its final distribution through pressing, the system achieves both coverage and precision.
3Reliability
If the bonding material flows out beyond the bonding face during pressing, then the bonding stability is improved, but the manufacturing complexity increases
Solution Approach 1:
The bonding material automatically flows out beyond the bonding face during the pressing operation itself, without requiring additional steps or equipment. The pressing action that is already part of the bonding process naturally distributes the material, making the system self-sufficient.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stable and consistent bonding of components, enhancing the quality and reliability of devices like light emitting devices.
Implementation Method 1
at least a portion of the bonding material interposed between the mounting face of the base and the bonding face of the component flows out beyond another portion of the outline of the bonding face of the component
Data Source
AI summary
A device manufacturing method includes: applying a bonding material in a predetermined position on a mounting face of a base by dispensing the bonding material through a nozzle of a bonding machine, in which an outline of a leading end face of the nozzle defines a shape that does not extend beyond a bonding face of a component to be mounted, so that the bonding material applied onto the mounting face has an outline that only partially extends beyond a portion of an outline of the bonding face; and bonding the bonding face in the predetermined position on the mounting face by placing and pressing the component onto the base so that at least a portion of the bonding material flows out beyond another portion of the outline of the bonding face other than the portion beyond which the bonding material extended in the applying of the bonding material.