Nozzle Cleaning Device Using Peripheral Runners for Semiconductor Manufacturing
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Solution Overview
Problem
Current cleaning methods for nozzles in semiconductor manufacturing are insufficient, leading to contamination and reduced product yield and machine productivity due to inadequate removal of contaminants and residues.
Innovation Solution
A cleaning device and method utilizing a body with rows of runners to introduce and discharge cleaning agents, ensuring dynamic cleaning and drying of nozzle surfaces, with adjustable flow rates and agents like surfactants and inert gases to effectively remove contaminants and residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shutdown maintenance is performed to clean nozzles, then contamination is removed, but product yield and machine productivity are seriously affected
Solution Approach 1:
The cleaning device performs preliminary cleaning actions during or between production cycles rather than requiring full shutdown maintenance. The body with runners introduces cleaning agents to nozzles proactively, preventing contamination buildup that would require later shutdown cleaning, thus maintaining productivity while removing harmful factors.
2Object-affected harmful factors
If regular shutdown maintenance is performed to clean nozzles, then contamination is reduced, but product yield is affected
Solution Approach 1:
The cleaning device enables nozzles to be cleaned without removing them from the production system. The body surrounds the nozzle in place, and runners deliver cleaning agents directly to the nozzle surface, allowing the nozzle to serve its spraying function while simultaneously being cleaned, thus maintaining product yield while reducing contamination.
3Object-affected harmful factors
If wiping and cleaning is performed on nozzles, then some contamination is removed, but cleaning is not sufficient
Solution Approach 1:
The cleaning device uses hydraulic or pneumatic systems to deliver cleaning agents through the runners to the nozzle surface. This fluid-based delivery method provides more thorough and consistent cleaning coverage compared to manual wiping, effectively removing contamination that wiping cannot eliminate while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures thorough cleaning and drying of nozzle surfaces, improving product yield and production efficiency by preventing contamination and residue buildup.
Implementation Method 1
at least one row of first runners configured to introduce a cleaning agent, where the first runners are arranged along an outer circumference of the body, an outlet of each of the first runners communicates with the body
Implementation Method 2
introducing at least one row of cleaning agents into the body from an outer circumference of the body, and cleaning the nozzle from the cleaning position
Implementation Method 3
discharging the cleaning agent through a body outlet
Data Source
AI summary
Embodiments of the present disclosure relate to a cleaning device and a method of cleaning a nozzle, and relate to the technical field of semiconductor manufacturing. The cleaning device includes: a body configured to surround the nozzle, where the body includes a body inlet and a body outlet; and at least one row of first runners configured to introduce a cleaning agent, where the first runners are arranged along an outer circumference of the body, an outlet of each of the first runners communicates with the body, and a cleaning position is formed at the outlet of the first runner.