Nozzle Cooling Module for Targeted Electronic Hot Spots
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling systems, particularly air cooling and conventional liquid cooling, struggle to provide even and efficient heat dissipation for electrical components, especially with the increased heat generation of modern components, limiting their peak performance and risking damage or safety hazards.
Innovation Solution
A nozzle arrangement that disperses liquid coolant directly onto electronic components, utilizing mounts with apertures and grooves to optimize cooling, coupled via snap-fit and push-fit connections, and a cooling module that directs coolant to specific areas of varying heat output components, including high, medium, and low temperature components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air cooling is used, then the cooling system is simple, but even cooling and sufficient heat dissipation cannot be achieved
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by using a pump to circulate coolant through pipes and nozzles. The liquid coolant is discharged directly onto heat-generating components, providing superior heat dissipation capability compared to air cooling while maintaining system simplicity through direct-contact cooling architecture.
Solution Approach 2:
The patent implements selective cooling by directing liquid coolant to specific high-heat areas of electronic components through nozzles. The cooling intensity is locally optimized based on heat generation patterns, with greater coolant flow to high-temperature zones and reduced flow to low-temperature zones, achieving even cooling across different component areas.
2Temperature
If liquid cooling with immersion is used, then heat exchange surface area is increased, but coolant usage and cost increase
Solution Approach 1:
The patent applies selective cooling by directing liquid coolant only to high-heat-generating components and specific hot spots on components rather than immersing all components in coolant. The nozzle system targets coolant flow precisely where heat dissipation is most needed, reducing overall coolant volume required while maintaining effective heat exchange.
Solution Approach 2:
The patent segments the cooling approach by categorizing components into high-temperature, medium-temperature, and low-temperature groups. Different cooling intensities are applied to each segment: high-heat components receive direct liquid cooling via nozzles, medium-heat components receive moderate cooling, and low-heat components receive minimal or no liquid cooling, optimizing coolant usage across the system.
3Power
If conventional liquid cooling is used, then cooling capacity is sufficient, but even distribution of coolant is difficult to achieve
Solution Approach 1:
The patent employs multiple nozzles positioned at different locations to discharge coolant at different flow rates according to local heat generation patterns. High-heat areas receive higher coolant flow while low-heat areas receive lower flow, achieving uniform temperature distribution across components while maintaining sufficient overall cooling capacity.
Solution Approach 2:
The patent uses a pump-driven dynamic coolant circulation system that can adjust flow rates to different nozzle zones. The system dynamically distributes coolant based on real-time cooling demands of different component areas, enabling adaptive control of coolant distribution to achieve even cooling across varying heat generation patterns.
4Temperature
If more coolant is used to improve cooling, then heat dissipation increases, but spillage and leakage risks increase
Solution Approach 1:
The patent uses targeted coolant discharge through nozzles positioned close to heat-generating components, delivering cooling precisely where needed with minimal coolant volume. This localized approach reduces overall coolant inventory in the system, thereby reducing potential spillage and leakage risks while maintaining effective cooling performance.
Solution Approach 2:
The patent employs a closed-loop liquid cooling system with pump-driven circulation through sealed pipes and nozzles. This pressurized hydraulic system contains coolant within enclosed pathways, preventing spillage and leakage while enabling efficient heat transfer from components to coolant without requiring large coolant volumes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by directing coolant to the hottest parts of components, reducing coolant usage and costs, minimizing spillage and leakage risks, and enabling easy installation and maintenance, while improving performance and safety.
Implementation Method 1
a nozzle for discharging liquid coolant
Implementation Method 2
heat exchange between the heat generating electrical components and the coolant
Implementation Method 3
a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component
Data Source
AI summary
A nozzle arrangement for cooling an electronic component. The nozzle arrangement comprises: a nozzle for discharging liquid coolant; and a mount configured to disperse the liquid coolant, the mount further configured to be coupled with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.