Nozzle Liquid Cut-Off Control for High-Viscosity Substrate Coating

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Solution Overview

Problem

Current substrate treating apparatuses face challenges in adjusting the liquid cut-off position of treatment liquids with high viscosity, leading to poor liquid cut-off conditions that result in film thickness unevenness, coating unevenness, and nozzle contamination.

Innovation Solution

The method involves causing the suck back valve to perform suction operation in association with the closing operation of the on-off valve to adjust the liquid cut-off position, allowing for easy alignment with the nozzle tip end face and preventing poor liquid cut-off conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the on-off valve is closed at high speed to improve liquid cut-off condition, then liquid cut-off performance is improved, but pressure variation becomes excessive causing air bubble formation and coating unevenness

Engineering Contradiction:
Improveliquid cut-off conditionVSAvoidair bubble formation
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The suck back valve performs suction operation in advance during the on-off valve closing process to proactively prevent liquid cut-off deterioration before it occurs, eliminating the need for high-speed valve closing that causes pressure variation and air bubbles

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The suck back valve acts as an intermediary mechanism between the on-off valve and the liquid column, using suction to maintain proper liquid cut-off position without requiring the on-off valve to close at excessively high speeds, thereby preventing air bubble formation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the treatment liquid has high viscosity, then treatment effectiveness is improved, but liquid cut-off condition deteriorates significantly

Engineering Contradiction:
Improvetreatment effectivenessVSAvoidliquid cut-off condition
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The suck back valve serves as an intermediary that compensates for the poor stop performance and inertia of high viscosity liquids, using suction to maintain proper liquid cut-off position despite the liquid's resistance to flow changes

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system changes the operational parameters by introducing suction control that adapts to the viscosity characteristics of the treatment liquid, maintaining effective treatment while preventing liquid cut-off deterioration specific to high viscosity fluids

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables easy adjustment of the liquid cut-off position, preventing film thickness unevenness, coating unevenness, and nozzle contamination, while ensuring stable liquid cut-off performance even with high viscosity treatment liquids.

Implementation Method 1

causing the suck back valve to perform suction operation in association with the closing operation by the on-off valve

Methodology Applied
Scientific EffectSuction: Suction

Implementation Method 2

the treatment liquid cut off below the nozzle 108 and hung down is drawn back toward the nozzle 108 by a surface tension of the treatment liquid

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 3

an on-off valve provided on the pipe... causing the on-off valve to perform closing operation

Methodology Applied
Scientific EffectValve operation: Valve

Data Source

PatentUS20250108403A1Treatment liquid supplying method and substrate treating apparatus
Publication Date: 2025.04.03 SCREEN HOLDINGS CO LTD
  • US20250108403A1 patent drawing
  • US20250108403A1 patent drawing
  • US20250108403A1 patent drawing

AI summary

The present invention relates to a treatment liquid supplying method and a substrate treating apparatus. The treatment liquid supplying method for a substrate treating apparatus provided with a nozzle configured to eject a treatment liquid, a pipe connected to the nozzle, an on-off valve provided on the pipe, and a suck back valve provided on the pipe between the nozzle and the on-off valve includes an ejection stopping step of stopping ejection of the treatment liquid from the nozzle by causing the on-off valve to perform closing operation, and a liquid cut-off position adjusting step of adjusting a liquid cut-off position as a position where the treatment liquid in a column shape ejected from the nozzle is cut off by causing the suck back valve to perform first suction operation in association with the closing operation by the on-off valve.