Additive Manufacturing Nozzle Dynamics for PCB Trace Formation
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Solution Overview
Problem
Creating electrical connections on printed circuit boards (PCBs) is challenging due to the need for precise and efficient methods to form and extend electronic traces.
Innovation Solution
An additive manufacturing method using a print head with a nozzle to deposit an ink composition onto a substrate, moving the nozzle away to form a structure, and repeatedly adjusting the nozzle's position to increase the structure's height and length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to create electrical connections on PCBs, then the manufacturing process is simpler, but the precision and efficiency of forming electronic traces deteriorates
Solution Approach 1:
The patent changes the physical state and deposition parameters of the ink composition by controlling nozzle height, deposition speed, and ink flow rate. This enables precise formation of electronic traces with controlled thickness and conductivity, resolving the contradiction between manufacturing precision and process complexity.
Solution Approach 2:
The patent employs a dynamic deposition process where the nozzle height is continuously adjusted during printing. The system transitions between different deposition modes (contact vs. non-contact) to achieve varying trace heights and aspect ratios, improving manufacturing precision while managing process complexity through automated control.
2Shape
If the nozzle is moved away from the substrate to form taller structures, then the aspect ratio of the trace improves, but the number of deposition cycles increases
Solution Approach 1:
The patent uses periodic deposition cycles where the nozzle alternates between approaching and retracting from the substrate. During each cycle, ink is deposited only during the approach phase, creating controlled layers that build up the trace height over time. This periodic action enables high aspect ratio formation while managing productivity through optimized cycle timing.
Solution Approach 2:
The system performs preliminary positioning and height adjustment before each deposition event. By pre-positioning the nozzle at the optimal height and preparing the ink flow rate in advance, the system minimizes the time required for each deposition cycle, thereby improving productivity while maintaining the desired aspect ratio.
3Shape
If the nozzle deposits ink while moving away from the substrate, then the trace height increases, but the control precision of deposition location deteriorates
Solution Approach 1:
The patent employs feedback control where the system continuously monitors the actual nozzle position and substrate interaction. Based on this feedback, the controller adjusts the deposition parameters in real-time to compensate for position variations, maintaining high deposition location accuracy even as trace height increases through multiple cycles.
Solution Approach 2:
The system dynamically adjusts the deposition parameters including ink flow rate and nozzle speed based on the current trace height and desired final geometry. This dynamic control enables the system to maintain precision in deposition location while building up trace height through controlled layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the precise formation and extension of electrically conductive traces on PCBs, achieving desirable aspect ratios and enhancing electrical conductivity and mechanical stability.
Implementation Method 1
An ink composition from the nozzle is deposited onto the first location of the substrate while moving the nozzle away from the substrate to increase a first distance therebetween, thereby forming a first portion of a structure
Data Source
AI summary
A method for additive manufacturing and an additive manufacturing apparatus are provided. The method includes disposing a nozzle of a print head of an additive manufacturing system over a location on a substrate. An ink composition from the nozzle is deposited onto the location of the substrate while moving the nozzle away from the substrate to increase a distance therebetween, thereby forming a portion of a structure on the location. The method includes repeatedly, as necessary to increase a distance the portion of the substrate protrudes from the substrate, performing the following over the location: moving the nozzle away from the substrate while not depositing the ink composition, moving the nozzle towards the substrate, and dispensing the ink composition from the nozzle onto the structure while moving the nozzle away from the substrate.