Nozzle Unit Head Positioning for Substrate Cleaning
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Solution Overview
Problem
Existing substrate treatment processes face challenges in efficiently cleaning and drying substrates without damaging them, often resulting in particles being left on the substrate due to increased hydraulic pressure from higher discharge volumes of cleaning solutions and drying gases.
Innovation Solution
The proposed substrate treating apparatus includes a spin chuck, a nozzle unit with multiple cleaning and drying nozzles, and a controller. The nozzle unit's head moves between two positions, adjusting the impact points of the cleaning solution and drying gas across the substrate, allowing for controlled discharge patterns and flow rates to minimize substrate damage and particle residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the amount of cleaning solution and drying gas discharged from the nozzle is increased to increase throughput, then productivity is improved, but the substrate may be damaged or particles may be left on the substrate due to increased hydraulic pressure
Solution Approach 1:
The nozzle is divided into multiple independent nozzle groups (first, second, third, and fourth nozzle groups) arranged at different angular positions. Each nozzle group can be independently controlled to discharge cleaning solution or drying gas. This segmentation allows the system to distribute the discharge load across multiple nozzles rather than concentrating high pressure in fewer nozzles, thereby maintaining substrate safety while achieving high throughput through coordinated operation of all nozzle groups.
2Speed
If the hydraulic pressure of the cleaning solution is increased to improve cleaning efficiency, then cleaning speed is improved, but particles may be left on the substrate and the substrate may be damaged
Solution Approach 1:
The cleaning function is segmented across multiple nozzle groups discharged at different angular positions. Each nozzle group operates at optimized pressure levels, collectively achieving thorough cleaning without requiring excessive pressure from individual nozzles. This prevents particle generation and substrate damage while maintaining high cleaning efficiency through the combined effect of multiple discharge streams.
Solution Approach 2:
The system dynamically switches between different nozzle groups discharging cleaning solution and drying gas based on the rotational position of the substrate. The controller activates specific nozzle groups at appropriate timing intervals, creating a dynamic cleaning pattern that maintains optimal pressure at all times while ensuring complete coverage of the substrate surface throughout the rotation cycle.
3Speed
If the substrate rotation speed is increased to improve drying efficiency, then drying speed is improved, but the cleaning solution may not be properly removed and particles may be generated
Solution Approach 1:
The system employs dynamic coordination between substrate rotation speed and nozzle activation timing. The controller synchronizes the activation of cleaning and drying nozzles with the rotational position of the substrate, ensuring that cleaning solution is applied and removed at optimal speeds. This dynamic control prevents particle generation while maintaining high drying efficiency through precisely timed gas discharge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient cleaning and drying of substrates by precisely controlling the discharge of cleaning solutions and drying gases, reducing the risk of substrate damage and particle residue, and allowing for rapid processing without relying on substrate rotation for drying.
Implementation Method 1
a spin chuck for supporting a substrate and rotatable
Implementation Method 2
a nozzle unit for supplying a cleaning solution and drying gas onto the substrate supported by the spin chuck
Implementation Method 3
a plurality of drying nozzles provided on the head and for discharging the drying gas
Data Source
AI summary
Disclosed is an apparatus for treating a substrate, the apparatus including: a spin chuck for supporting a substrate and rotatable; a nozzle unit for supplying a cleaning solution and drying gas onto the substrate supported by the spin chuck; and a controller for controlling the nozzle unit, in which the nozzle unit includes: a head; a plurality of cleaning nozzles provided on the head and for discharging the cleaning solution; a plurality of drying nozzles provided on the head and for discharging the drying gas; and a driver for moving the head from a first position to a second position, when the head is in the second position, an impact point of the cleaning solution discharged from the plurality of cleaning nozzles onto the substrate is at a location farther from a center of the substrate than an impact point of the cleaning solution when the head is in the first position, the cleaning solution is discharged simultaneously from the plurality of cleaning nozzles, the impact points of the cleaning solution are located at different distances from the center of the substrate, when the drying gas is discharged simultaneously from the plurality of drying nozzles, the impact points of the drying gas are located at different distances from the center of the substrate, and when the cleaning solution and the drying gas are discharged simultaneously, the impact point of the cleaning solution is located farther from the center of the substrate than the impact point of the drying gas.