Nozzle Layered Structure for Semiconductor Coating Lot Transition
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Solution Overview
Problem
In semiconductor device fabrication, the process of changing between lots in a multi-nozzle system results in unnecessary standby time due to the formation of a layered structure in nozzles, which delays the initiation of coating when the substrate is loaded into the liquid processing unit, as the nozzle must be moved to a standby position and undergo dummy dispensing, affecting throughput.
Innovation Solution
Integrating nozzles for preceding and following lots into a common movement mechanism, allowing them to be moved between liquid processing units and a standby area, where a solvent layer is formed between gas layers within the nozzle, enabling quick transition to the next lot without extending standby time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a nozzle is moved to a standby position and a layered structure (air layer, solvent layer, air layer) is formed to prevent resist solution from becoming dry, then the nozzle is protected from drying out, but the initiation of coating is delayed when the substrate is loaded, generating unnecessary preparation standby time
Solution Approach 1:
The patent applies preliminary action by performing dummy dispensing before the actual coating process to release the layered structure in advance. This ensures that when the substrate is loaded, the nozzle is already ready to dispense coating liquid immediately, eliminating preparation standby time while maintaining nozzle protection through the pre-formed layered structure
2Adaptability or versatility
If multiple nozzles are integrated into a common movement mechanism to serve multiple liquid processing units, then device complexity is reduced and versatility increases, but the nozzle must share movement resources causing delays when switching between lots
Solution Approach 1:
The patent applies preliminary action by moving the integrated nozzle to the standby position and forming the layered structure in advance, before the actual lot switching occurs. This preliminary preparation ensures that when the substrate is loaded into the liquid processing unit, the nozzle is already positioned and ready, eliminating delays caused by the shared movement mechanism
Solution Approach 2:
The patent maintains continuity of useful action by keeping the nozzle in a ready state with the layered structure formed during the substrate loading time. This allows the coating process to begin immediately when the substrate is loaded, ensuring continuous productive operation despite the integrated nozzle serving multiple units
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces unnecessary standby time and allows for immediate processing of the follow-up lot by forming a solvent layer between gas layers in the nozzle, thus maintaining high throughput during substrate lot changes.
Implementation Method 1
sucking air into the nozzle for the preceding lot to form an upper gas layer within the nozzle
Implementation Method 2
sucking a solvent into the nozzle for the preceding lot in the standby area... sucking gas of atmosphere into the nozzle for the preceding lot to form a lower gas layer within the nozzle so that a solvent layer is interposed between the upper gas layer and the lower gas layer
Data Source
AI summary
A device to form a coating film which can quickly coat a substrate of a follow-up lot after coating a preceding lot. The device is configured such that nozzles for a preceding lot and a following lot are integrated into a common movement mechanism and moved between an upper side of a liquid processing unit and a standby area. A coating method includes sucking air into the nozzle for the preceding lot to form an upper gas layer, sucking a solvent for the preceding lot in the standby area to form a thinner layer, and sucking air into the nozzle for the preceding lot to form a lower gas layer within the nozzle, and thus forming a state that a solvent layer is interposed between the upper gas layer and the lower gas layer.