Nozzle Position Synchronization for Substrate Peripheral Processing
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Solution Overview
Problem
Conventional substrate processing methods struggle to achieve high accuracy in processing the peripheral portion of substrates due to uncertainties in nozzle position caused by mechanical inaccuracies and eccentricities, leading to inefficiencies in film removal and utilization of substrate area.
Innovation Solution
A substrate processing apparatus with a rotation holder, nozzle mechanism, position detector, and position adjuster that synchronizes the nozzle's position with the substrate's peripheral changes, ensuring precise alignment and phase control to accurately discharge processing liquids onto the substrate's peripheral portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the nozzle position is fixed based on mechanical accuracy, then the device complexity is reduced, but the manufacturing precision of peripheral portion processing deteriorates due to uncertainties of several hundreds μm
Solution Approach 1:
The patent implements a feedback control system where the position detector continuously monitors the actual position of the substrate peripheral portion during rotation. The position adjuster receives feedback signals about position deviations (caused by mechanical inaccuracies and eccentricity) and automatically adjusts the nozzle position to compensate. This closed-loop feedback mechanism enables high processing accuracy without requiring extremely complex mechanical precision.
Solution Approach 2:
The patent replaces reliance on pure mechanical positioning accuracy with a combination of detection and active adjustment systems. Instead of depending solely on mechanical components to maintain precise nozzle positioning, the system uses position detection (optical or other non-contact methods) and active position adjustment to achieve the required precision, substituting mechanical rigidity with control system intelligence.
2Productivity
If the nozzle is moved in radial direction to process peripheral portion, then the productivity is improved, but the manufacturing precision deteriorates due to difficulty in maintaining constant width region
Solution Approach 1:
The patent transitions from a static nozzle positioning approach to a dynamic one. The nozzle position is continuously adjusted during substrate rotation to track the actual peripheral portion position. This dynamic adjustment, occurring in real-time as the substrate rotates and the nozzle moves radially, enables both high productivity and constant width region accuracy by adapting to position variations on the fly.
Solution Approach 2:
The feedback control loop continuously monitors the position of the substrate peripheral portion and adjusts the nozzle position accordingly. This feedback mechanism ensures that even when the nozzle moves radially to process different regions, the system maintains accurate tracking of the constant width region, preventing width variations that would compromise manufacturing precision.
3Manufacturing precision
If the position of peripheral portion is detected and nozzle position is adjusted periodically, then the manufacturing precision is improved, but the loss of time increases due to additional detection and adjustment operations
Solution Approach 1:
The patent implements continuous position detection and continuous position adjustment during substrate rotation, rather than periodic sampling and adjustment. The position detector operates continuously to track the peripheral portion position, and the position adjuster continuously modifies the nozzle position in response. This continuous operation eliminates idle time between detection cycles and ensures uninterrupted alignment, reducing overall time loss while maintaining high precision.
Data Source
AI summary
Positions of an outer periphery of a rotating substrate and a processing liquid nozzle are detected. An amplitude of a change with time of the position of the outer periphery of the substrate detected during rotation is acquired. In a direction passing through a rotational center and parallel with the rotating substrate, a relative position of the processing liquid nozzle with respect to the spin chuck is periodically changed at a frequency equal to a rotational frequency of the spin chuck and the acquired amplitude. A difference between a phase of a change with time of the position of the processing liquid nozzle and a phase of a change with time of the position of the outer periphery of the substrate is adjusted to not more than a predetermined value. A processing liquid is discharged from the processing liquid nozzle to a peripheral portion of the rotating substrate.