Nozzle Position Adjustment via Liquid Pressure Mapping
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in accurately determining and adjusting the discharge position of a nozzle for precise edge etching of substrates, relying on visual inspection or test plates which are prone to errors.
Innovation Solution
A substrate processing apparatus and method that utilize an adjustment unit with pressure detecting elements and a mapping part to quantitatively determine the nozzle discharge position, allowing for precise adjustment without visual inspection or test plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If visual inspection or test plate method is used to determine discharge position, then the apparatus structure remains simple, but the measurement precision and reliability are insufficient
Solution Approach 1:
The patent replaces the mechanical/visual inspection method with an optical measurement system. A camera captures images of the liquid discharge pattern, and image processing algorithms automatically determine the discharge position and distribution characteristics, eliminating the need for manual visual inspection and test plates.
Solution Approach 2:
The patent introduces an intermediary measurement system consisting of a camera and image processing unit. This intermediary system captures and processes information about the liquid discharge pattern, serving as a mediator between the nozzle and the control system, thereby enabling precise discharge position determination without direct manual measurement.
2Reliability
If manual measurement methods are used, then the apparatus remains simple, but the reliability and consistency of discharge position determination vary
Solution Approach 1:
The system performs self-measurement and self-adjustment. The camera automatically captures the discharge pattern, the image processing unit automatically analyzes the data to determine discharge position and distribution, and the control system automatically adjusts the nozzle position based on this analysis, eliminating dependence on manual measurement and ensuring consistent, reliable results.
Solution Approach 2:
The patent implements a closed-loop feedback system. The camera continuously monitors the liquid discharge pattern, the image processing unit analyzes the discharge position and distribution, and the control system uses this information to adjust the nozzle position. This feedback loop ensures consistent and reliable discharge position determination by continuously adapting to variations in the discharge pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and quantitative determination of the nozzle discharge position, improving the precision of substrate edge etching and reducing variability associated with manual measurement methods.
Implementation Method 1
a sensing part coupled to a top surface of the base part and including a plurality of pressure detecting elements that generates pressure data when receiving a pressure
Data Source
AI summary
Disclosed is an apparatus for processing a substrate, the apparatus including: a cup providing a processing space; a support unit provided in the processing space, and for supporting a substrate; a support unit provided in the processing space, and for supporting a substrate; a liquid supply unit including a nozzle for discharging a liquid to the substrate; a position adjuster coupled to the nozzle and for adjusting a position of the nozzle; and an adjustment unit coupled to the support unit, and for detecting pressure data when the liquid discharged from the nozzle meets the adjustment unit and position information at which the pressure data is generated.