Treating Material Nozzle Control for Pressure Wave Suppression
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Solution Overview
Problem
In photolithography processes, the precise control of treating material discharge is challenging due to suboptimal operation of cut-off valves, leading to defects in semiconductor devices.
Innovation Solution
An apparatus with a cut-off valve system controlled by two controllers, where the second controller adjusts the opening and closing times based on pressure wave feedback from a sensor to optimize the discharge of treating materials, minimizing defects by managing pressure waves generated during valve operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single controller operates the cut-off valve, then the device complexity is low, but the discharge precision of treating material is insufficient
Solution Approach 1:
The control function is segmented into two independent controllers: a first controller that manages the opening phase of the cut-off valve and a second controller that manages the closing phase. This segmentation allows each controller to independently optimize its respective phase without interference, thereby improving the overall discharge precision of the treating material while maintaining manageable system complexity through functional decomposition.
Solution Approach 2:
The system dynamically adjusts the operating parameters of the cut-off valve by using two controllers that can independently set different opening and closing speeds. This dynamic control capability enables precise adjustment of the valve's behavior during different phases of operation, improving discharge precision without requiring a completely complex mechanical structure.
2Productivity
If the cut-off valve opens and closes quickly, then the productivity is high, but the discharge precision deteriorates due to suboptimal control
Solution Approach 1:
The system enables dynamic control of the cut-off valve by allowing the first controller to independently adjust the opening speed and the second controller to independently adjust the closing speed. This dynamic parameter adjustment capability allows the valve to operate quickly when needed for high productivity while maintaining precise control over the discharge process, thereby resolving the trade-off between speed and precision.
Solution Approach 2:
The system changes the operational parameters (opening speed and closing speed) of the cut-off valve independently through two separate controllers. By allowing these parameters to be adjusted without being coupled, the system can optimize for either speed or precision depending on process requirements, thus improving both productivity and discharge precision simultaneously.
3Reliability
If the cut-off valve is controlled without pressure wave management, then the device complexity is low, but defects occur in semiconductor devices
Solution Approach 1:
The control function is segmented into two independent controllers: a first controller that manages the opening phase of the cut-off valve and a second controller that manages the closing phase. This segmentation allows each controller to independently optimize its respective phase without interference, thereby improving the overall discharge precision of the treating material while maintaining manageable system complexity through functional decomposition.
Solution Approach 2:
The system dynamically adjusts the operating parameters of the cut-off valve by using two controllers that can independently set different opening and closing speeds. This dynamic control capability enables precise adjustment of the valve's behavior during different phases of operation, improving discharge precision without requiring a completely complex mechanical structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise control of treating material discharge, reducing defects in semiconductor devices by optimizing the phase and amplitude of pressure waves, thereby enhancing the manufacturing process efficiency.
Implementation Method 1
A first pressure wave is generated at a first closing time point of the cut-off valve, and a second pressure wave having a phase difference with respect to the first pressure wave is generated at a second closing time point of the cut-off valve
Data Source
AI summary
An apparatus for supplying a treating material includes a nozzle discharging the treating material onto a substrate. A flow pipe channels the treating material to the nozzle. A cut-off valve connected to the flow pipe controls the discharge the treating material. A first controller controls a first opening and closing of the cut-off valve. A second controller controls a second opening and closing of the cut-off valve. The second opening and closing of the cut-off valve is performed by the second controller after a delay time has elapsed after the first opening and closing is completed.