Integrated Nozzle Skimmer for High-Resolution Organic Vapor Jet Printing
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Solution Overview
Problem
Conventional organic vapor jet printing (OVJP) techniques face challenges in achieving high-resolution patterned organic thin films without the use of shadow masks, often requiring close nozzle-substrate distances and large amounts of carrier gas, leading to issues like overspray and loss of pixel definition.
Innovation Solution
The use of integrated nozzle/skimmer structures with monolithically integrated nozzles and skimmers, which produce a collimated beam of organic material, allowing for higher-resolution printing at larger working distances and reducing overspray by concentrating the organic flux relative to the carrier gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional OVJP techniques are used without shadow masks, then device complexity is reduced, but manufacturing precision deteriorates due to loss of pixel definition
Solution Approach 1:
The patent divides the single nozzle function into two separate components: a nozzle for delivering organic material and carrier gas, and a skimmer for collimating the flow. This segmentation allows the nozzle to operate without a shadow mask while the skimmer provides the necessary flow control to maintain pixel definition, resolving the contradiction between device simplicity and manufacturing precision
Solution Approach 2:
The skimmer acts as an intermediary component between the nozzle and substrate. It mediates the organic material-carrying gas flow by collimating it, thereby maintaining pixel definition without requiring a shadow mask. This intermediary element enables both device simplicity and manufacturing precision to coexist
2Ease of operation
If nozzle-substrate distance is increased, then ease of operation is improved, but manufacturing precision deteriorates due to beam divergence
Solution Approach 1:
The skimmer performs preliminary collimation of the organic material beam before it travels to the substrate. By pre-aligning and confining the beam flow at the skimmer location, the system maintains beam integrity over longer distances, enabling increased working distances without sacrificing pattern resolution
Solution Approach 2:
The patent changes the flow parameters of the organic material-carrying gas by using the skimmer to create a collimated beam with reduced divergence. This parameter change in beam morphology allows the system to operate at larger nozzle-substrate distances while maintaining manufacturing precision
3Productivity
If large amounts of carrier gas are used, then productivity is improved, but loss of substance increases due to overspray
Solution Approach 1:
The skimmer creates a localized region of high organic material concentration by collimating the beam, while the surrounding carrier gas flow is directed away from the substrate. This local quality differentiation allows efficient deposition where needed while minimizing overspray and material loss in surrounding areas
Solution Approach 2:
The patent converts the potentially harmful effect of excess carrier gas (which causes overspray) into a beneficial collimated flow. The skimmer redirects the carrier gas flow to support the organic material beam rather than allowing it to disperse, thereby maintaining productivity while reducing substance loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-resolution printing of patterned organic thin films without the need for shadow masks, maintaining resolution even at increased distances between the nozzle array and substrate, and reduces overspray by focusing the organic material beam.
Implementation Method 1
produce a collimated beam of organic material, allowing for higher-resolution printing at larger working distances and reducing overspray by concentrating the organic flux relative to the carrier gas
Implementation Method 2
Each nozzle is in fluid communication with a carrier gas source and an organic material source and is configured to eject the organic material and carrier gas toward a substrate
Data Source
AI summary
Embodiments disclosed herein provide devices having a nozzle die with one or more nozzles, each of which has one or more integrated skimmers. The use of an integrated nozzle/skimmer structure allows for higher-resolution printing in OVJP-type deposition techniques without requiring the use of a shadow mask by allowing for a relatively narrow organic material beam that can be placed at relatively high distances away from the substrate.


